Results 281 to 290 of about 366,258 (347)
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38th Electronics Components Conference 1988., Proceedings., 2003
A photodefinable polyimide based on 3,3',4,4'-benzophenone tetracarboxylic dianhydride, oxydianiline, and metaphenylene-diamine (BTDA-ODA-MPD) was studied for its application as a stress buffer film over the passivation in a plastic-encapsulated device.
M.M. Khan, T.S. Tarter, H. Fatemi
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A photodefinable polyimide based on 3,3',4,4'-benzophenone tetracarboxylic dianhydride, oxydianiline, and metaphenylene-diamine (BTDA-ODA-MPD) was studied for its application as a stress buffer film over the passivation in a plastic-encapsulated device.
M.M. Khan, T.S. Tarter, H. Fatemi
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On-die sensors for measuring process and environmental variations in integrated circuits
Proceedings of the 20th symposium on Great lakes symposium on VLSI, 2010We present compact on-die variation monitoring circuits for measuring process and environmental fluctuations in product chips. The process characterization structure can be used to isolate process induced systematic and random variation in NFET and PFET devices.
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20th International Reliability Physics Symposium, 1982
A systematic investigation into the performance of plastic encapsulated integrated circuits during humidity testing has been conducted. A failure mechanism has been identified for devices assembled on copper lead frames and traced to the silver loaded polymer used for attaching the I.C. to the frame. Reliability data are presented for devices assembled
Kenneth E. Manchester +2 more
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A systematic investigation into the performance of plastic encapsulated integrated circuits during humidity testing has been conducted. A failure mechanism has been identified for devices assembled on copper lead frames and traced to the silver loaded polymer used for attaching the I.C. to the frame. Reliability data are presented for devices assembled
Kenneth E. Manchester +2 more
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Ninth IEEE/CHMT International Symposium on Electronic Manufacturing Technology,Competitive Manufacturing for the Next Decade, 2002
The authors present a characterization methodology using per-die test structures to address the need for accurate and reliable product-process models for mixed-signal IC designs. These product-process relationships are critical in generating guardbands and forecasting production yields based on predicted product performance across process variations ...
N. Goel +3 more
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The authors present a characterization methodology using per-die test structures to address the need for accurate and reliable product-process models for mixed-signal IC designs. These product-process relationships are critical in generating guardbands and forecasting production yields based on predicted product performance across process variations ...
N. Goel +3 more
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Six-channel neural signal regeneration integrated circuit
Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2009A six-channel neural signal regeneration integrated circuit (IC) was designed and fabricated in CSMC’s 0.5-μm CMOS technology. The circuit consists of a low-noise and high common mode rejection ratio (CMRR) instrument amplifier, an inverted operational ...
Wenyuan Li +4 more
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Journal of Micromechanics and Microengineering, 2020
Among the advanced integrated circuit (IC) integration methods, three-dimensional heterogeneous integration with through-silicon via (TSV) technology showed great potential towards the system-level integration with an increased interconnect density in a smaller footprint. However, the heat mitigation across several dies remains a critical issue in this
Hemanth Kumar Cheemalamarri +3 more
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Among the advanced integrated circuit (IC) integration methods, three-dimensional heterogeneous integration with through-silicon via (TSV) technology showed great potential towards the system-level integration with an increased interconnect density in a smaller footprint. However, the heat mitigation across several dies remains a critical issue in this
Hemanth Kumar Cheemalamarri +3 more
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Deep learning techniques for integrated circuit die performance prediction
MRS Advances, 2022Alexander Kovalenko +2 more
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IFAC Proceedings Volumes, 1965
Abstract Die standig fortschreitende Entwicklung der verschiedenen Formen integrierter Schaltungen wird einem Evolutionsgedanken unterzuordnen versucht. Ausgehend von dem sich als auserst fruchtbar erweisenden Konzept, die Drucktechnik zur Realisierung elektrischer Schaltungen zu verwenden, wird man systematisch von der kupfer-kaschierten Platine bis
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Abstract Die standig fortschreitende Entwicklung der verschiedenen Formen integrierter Schaltungen wird einem Evolutionsgedanken unterzuordnen versucht. Ausgehend von dem sich als auserst fruchtbar erweisenden Konzept, die Drucktechnik zur Realisierung elektrischer Schaltungen zu verwenden, wird man systematisch von der kupfer-kaschierten Platine bis
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Journal of Intelligent Manufacturing, 2020
Wenhan Fu, C. Chien, Lizhen Tang
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Wenhan Fu, C. Chien, Lizhen Tang
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