Results 281 to 285 of about 260,602 (285)

Integrated modeling of chemical mechanical planarization/polishing (CMP) for integrated circuit fabrication: From particle scale to die and wafer scales

, 2003
Jianfeng Luo
openalex  

Some of the next articles are maybe not open access.

Related searches:

Circuit Design Method for Reducing Static Current Consumption and Integrated Circuit Die Self-Heating in High-Temperature Transimpedance and Operational Amplifiers Based on Field-Effect Transistors

2024 International Conference on Actual Problems of Electron Devices Engineering (APEDE)
Anna V. Bugakova, Ilya V. Frolov, Dmitriy V. Kleimenkin, Nikolay N. Prokopenko   +3 more
openaire   +1 more source

Design of plastic package die with multi-injection head for integrated circuit

, 2007
Jian Ye
openalex  

The Design of Flat Package Integrated Circuits Lead Die

, 2008
Xiaoyu Huang
openalex  

Space product assurance. Design, selection, procurement and use of die form monolithic microwave integrated circuits (MMICs)

2014
openaire   +1 more source