Results 21 to 30 of about 127,361 (299)

Number Determination of Successfully Packaged Dies Per Wafer Based on Machine Vision

open access: yesMachines, 2015
Packaging the integrated circuit (IC) chip is a necessary step in the manufacturing process of IC products. In general, wafers with the same size and process should have a fixed number of packaged dies.
Hsuan-Ting Chang   +2 more
doaj   +1 more source

Design and Fabrication Technology of Low Profile Tactile Sensor with Digital Interface for Whole Body Robot Skin

open access: yesSensors, 2018
Covering a whole surface of a robot with tiny sensors which can measure local pressure and transmit the data through a network is an ideal solution to give an artificial skin to robots to improve a capability of action and safety.
Mitsutoshi Makihata   +5 more
doaj   +1 more source

A Low-Noise Interface ASIC for MEMS Disk Resonator Gyroscope

open access: yesMicromachines, 2023
This paper proposes a low-noise interface application-specific integrated circuit (ASIC) for a microelectromechanical systems (MEMS) disk resonator gyroscope (DRG) which operates in force-to-rebalance (FTR) mode.
Wenbo Zhang   +7 more
doaj   +1 more source

Reference-free detection of semiconductor assembly defect [PDF]

open access: yes, 2005
This paper aims at developing a novel defect detection algorithm for the semiconductor assembly process by image analysis of a single captured image, without reference to another image during inspection.
Chung, R   +4 more
core   +1 more source

Machine Learning Integrated Pseudo-3-D Flow for Monolithic 3-D ICs

open access: yesIEEE Journal on Exploratory Solid-State Computational Devices and Circuits, 2021
Monolithic 3-D (M3-D) IC design is a manufacturing technique that opens several new possibilities of chip design and exploration for power, performance, area (PPA), and cost benefits.
Sai Pentapati, Bon Woong Ku, Sungkyu Lim
doaj   +1 more source

Embedded 5V-to-3.3V Voltage Regulator for Supplying Digital ICs in 3.3V CMOS Technology [PDF]

open access: yes, 1998
A fully integrated 5 V-to-3.3 V supply voltage regulator for application in digital IC's has been designed in a 3.3 V 0.5 μm CMOS process. The regulator is able to deliver peak current transients of 300 mA, while the output voltage remains within a ...
Besten, Gerrit W. den, Nauta, Bram
core   +2 more sources

A voltage limiter circuit for indoor light energy harvesting applications [PDF]

open access: yes, 2013
A voltage limiter circuit for indoor light energy harvesting applications is presented. This circuit is a part of a bigger system, whose function is to harvest indoor light energy, process it and store it, so that it can be used at a later time.
J.A. Paradiso, L. Magnelli, S. Chalasani
core   +3 more sources

An Integrated Subharmonic Coupled-Oscillator Scheme for a 60-GHz Phased-Array Transmitter [PDF]

open access: yes, 2006
This paper describes the design of an integrated coupled-oscillator array in SiGe for millimeter-wave applications. The design focuses on a scalable radio architecture where multiple dies are tiled to form larger arrays. A 2 × 2 oscillator array for a 60-
Babakhani, Aydin   +3 more
core   +1 more source

Compact silicon photonics circuit to extract multiple parameters for process control monitoring [PDF]

open access: yes, 2020
We present a compact interferometer circuit to extract multiple model parameters of on-chip waveguides and directional couplers from optical measurements.
Bogaerts, Wim   +5 more
core   +2 more sources

Review of Chemical-Mechanical Planarization Modeling for Integrated Circuit Fabrication: From Particle Scale to Die and Wafer Scales

open access: closed, 2003
Modeling and simulation are critical to transfer CMP from an engineering 'art' to an engineering 'science'. Research efforts in CMP modeling have been attempted in the last decade. There is an urgent need to review the current models including their limitations and future research directions systematically.
Jianfeng Luo, David Dornfeld
openalex   +2 more sources

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