Results 21 to 30 of about 366,258 (347)

Integrating Metal-Oxide-Decorated CNT Networks with a CMOS Readout in a Gas Sensor

open access: yesSensors, 2012
We have implemented a tin-oxide-decorated carbon nanotube (CNT) network gas sensor system on a single die. We have also demonstrated the deposition of metallic tin on the CNT network, its subsequent oxidation in air, and the improvement of the lifetime ...
Suhwan Kim   +7 more
doaj   +1 more source

The Future of High Frequency Circuit Design [PDF]

open access: yes, 2009
The cut-off wavelengths of integrated silicon transistors have exceeded the die sizes of the chips being fabricated with them. Combined with the ability to integrate billions of transistors on the same die, this size-wavelength cross-over has produced
Hajimiri, Ali
core   +1 more source

Area-Efficient Integrated Current-Reuse Feedback Amplifier for Wake-Up Receivers in Wireless Sensor Network Applications

open access: yesSensors, 2022
Wireless sensor network (WSN) applications are under extensive research and development due to the need to interconnect devices with each other. To reduce latency while keeping very low power consumption, the implementation of a wake-up receiver (WuR) is
David Galante-Sempere   +3 more
doaj   +1 more source

Number Determination of Successfully Packaged Dies Per Wafer Based on Machine Vision

open access: yesMachines, 2015
Packaging the integrated circuit (IC) chip is a necessary step in the manufacturing process of IC products. In general, wafers with the same size and process should have a fixed number of packaged dies.
Hsuan-Ting Chang   +2 more
doaj   +1 more source

The Demonstration of S2P (Serial-to-Parallel) Converter with Address Allocation Method Using 28 nm CMOS Technology

open access: yesApplied Sciences, 2021
To improve the performance of analog, RF, and digital integrated circuits, the cutting-edge advanced CMOS technology has been widely utilized. We successfully designed and implemented a high-speed and low-power serial-to-parallel (S2P) converter for 5G ...
Min-Su Kim   +3 more
doaj   +1 more source

Reference-free detection of semiconductor assembly defect [PDF]

open access: yes, 2005
This paper aims at developing a novel defect detection algorithm for the semiconductor assembly process by image analysis of a single captured image, without reference to another image during inspection.
Chung, R   +4 more
core   +1 more source

Design and Fabrication Technology of Low Profile Tactile Sensor with Digital Interface for Whole Body Robot Skin

open access: yesSensors, 2018
Covering a whole surface of a robot with tiny sensors which can measure local pressure and transmit the data through a network is an ideal solution to give an artificial skin to robots to improve a capability of action and safety.
Mitsutoshi Makihata   +5 more
doaj   +1 more source

A Low-Noise Interface ASIC for MEMS Disk Resonator Gyroscope

open access: yesMicromachines, 2023
This paper proposes a low-noise interface application-specific integrated circuit (ASIC) for a microelectromechanical systems (MEMS) disk resonator gyroscope (DRG) which operates in force-to-rebalance (FTR) mode.
Wenbo Zhang   +7 more
doaj   +1 more source

A voltage limiter circuit for indoor light energy harvesting applications [PDF]

open access: yes, 2013
A voltage limiter circuit for indoor light energy harvesting applications is presented. This circuit is a part of a bigger system, whose function is to harvest indoor light energy, process it and store it, so that it can be used at a later time.
J.A. Paradiso, L. Magnelli, S. Chalasani
core   +3 more sources

Transient thermal transport in a three-dimensional integrated circuit (3D IC) with unequally sized die

open access: hybridInternational Communications in Heat and Mass Transfer
Vinay Dhakal   +2 more
openalex   +2 more sources

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