Results 301 to 310 of about 366,258 (347)

Thermally enhanced 3 dimensional integrated circuit (TE3DIC) packaging

Electronic Components and Technology Conference, 2014
S. Snyder, J. Thompson, A. King, E. Walters, P. Tyler, Michael Raymond Weatherspoon   +5 more
semanticscholar   +1 more source

Hybrid Integration of the Wavelength-Tunable Laser With a Silicon Photonic Integrated Circuit

Journal of Lightwave Technology, 2013
B. Snyder, B. Corbett, P. O'Brien
semanticscholar   +1 more source

Einfache mathematische Modelle für die Ausbeute bei integrierten Schaltungen, insbesondere bei Halbleiterspeichern / Simple mathematical models for the yield of integrated circuits especially with semiconductor memories

, 1972
W. Hilberg
openalex   +1 more source

An integrated H-bridge circuit in a HV technology

2016 IEEE 7th Latin American Symposium on Circuits & Systems (LASCAS), 2016
Bruno Bellini, A. Arnaud, Stephania Rezk, Maximiliano Chiossi   +3 more
semanticscholar   +1 more source

Wafer-Scale Dies-Transfer Bonding Technology for Hybrid III/V-on-Silicon Photonic Integrated Circuit Application

, 2016
Xianshu Luo, Yuanbing Cheng, Junfeng Song, Tsung-Yang Liow, Qi Jie Wang, Mingbin Yu   +5 more
openalex   +1 more source

Die-to-Die Bonding Development Employing Atomic Layer Deposition to Enable Heterogeneous Integration of Optoelectronic Integrated Circuits

2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
Yi Xuan Yeo, Sajay Bhuvanendran Nair Gourikutty, Hemanth Kumar Cheemalamarri, Ser Choong Chong, Eva Leong Ching Wai, Andrew Whye Keong Fong   +5 more
openaire   +1 more source

Interactive presentation: BIST method for die-level process parameter variation monitoring in analog/mixed-signal integrated circuits

, 2007
Amir Zjajo, José Pineda de Gyvez
openalex   +1 more source

Correlation of energy disorder and open-circuit voltage in hybrid perovskite solar cells

Nature Energy, 2016
Yuchuan Shao, Yong-bo Yuan, Jinsong Huang   +2 more
exaly  

Low Cost of Ownership scalable copper Direct Bond Interconnect 3D IC technology for three dimensional integrated circuit applications

IEEE International Conference on 3D System Integration, 2009
P. Enquist, G. Fountain, C. Petteway, A. Hollingsworth, H. Grady   +4 more
semanticscholar   +1 more source

Life cycle assessment of integrated circuit packaging technologies

, 2011
A. Andrae, O. Andersen
semanticscholar   +1 more source