Results 31 to 40 of about 124,738 (302)
Micromachines, 2021 Polymer materials attract more and more interests for a biocompatible package of novel implantable medical devices. Medical implants need to be packaged in a biocompatible way to minimize FBR (Foreign Body Reaction) of the implant.
Seonho Seok
doaj +1 more source
An Integrated Subharmonic Coupled-Oscillator Scheme for a 60-GHz Phased-Array Transmitter [PDF]
, 2006 This paper describes the design of an integrated coupled-oscillator array in SiGe for millimeter-wave applications. The design focuses on a scalable radio architecture where multiple dies are tiled to form larger arrays. A 2 × 2 oscillator array for a 60-
Babakhani, Aydin +3 more
core +1 more source
Wafer-Level Characterization and Monitoring Platform for Single-Photon Avalanche Diodes
IEEE Journal of the Electron Devices SocietyWhen developing a technology based on single-photon avalanche diodes (SPADs), the SPAD characterization is mandatory to debug, optimize and monitor the microfabrication process.
Samuel Parent +11 more
doaj +1 more source
Micromachines, 2018 Thermocompression bonding for wafer-level hermetic packaging was demonstrated at the lowest temperature of 370 to 390 °C ever reported using Al films with thin Sn capping or insertions as bonding layer.
Shiro Satoh +3 more
doaj +1 more source
Validation by Measurements of a IC Modeling Approach for SiP Applications [PDF]
, 2011 The growing importance of signal integrity (SI) analysis in integrated circuits (ICs), revealed by modern systemin-package methods, is demanding for new models for the IC sub-systems which are both accurate, efficient and extractable by simple ...
Canavero, Flavio +8 more
core +1 more source
Ring oscillator clocks and margins [PDF]
, 2016 How much margin do we have to add to the delay lines of a bundled-data circuit? This paper is an attempt to give a methodical answer to this question, taking into account all sources of variability and the existing EDA machinery for timing analysis and ...
Cortadella, Jordi +4 more
core +1 more source
Compact silicon photonics circuit to extract multiple parameters for process control monitoring [PDF]
, 2020 We present a compact interferometer circuit to extract multiple model parameters of on-chip waveguides and directional couplers from optical measurements.
Bogaerts, Wim +5 more
core +2 more sources
A 77-GHz Six-Port Sensor for Accurate Near-Field Displacement and Doppler Measurements
Sensors, 2018 A continuous-wave (CW) radar sensor design based on a millimetre-wave six-port interferometer is proposed. A complete sensor prototype is conceived of, fabricated and measured at 77 GHz for short-range professional and industrial applications.
Homa Arab +4 more
doaj +1 more source
IEEE Access, 2023 Bipolar junction transistors (BJT) are widely used integrated devices for analog circuits. For most of analog applications, the process variation and the match performance of BJT pairs are critical for the circuit design.
Xiaonian Liu, Zichen Yang
doaj +1 more source
Low-power, low-penalty, flip-chip integrated, 10Gb/s ring-based 1V CMOS photonics transmitter [PDF]
, 2013 Modulation with 7.5dB transmitter penalty is demonstrated from a novel 1.5Vpp differential CMOS driver flip-chip integrated with a Si ring modulator, consuming 350fJ/bit from a single 1V supply at bit rates up to 10Gb ...
Absil, P +10 more
core +1 more source