Results 31 to 40 of about 135,051 (299)
Validation by Measurements of a IC Modeling Approach for SiP Applications [PDF]
, 2011 The growing importance of signal integrity (SI) analysis in integrated circuits (ICs), revealed by modern systemin-package methods, is demanding for new models for the IC sub-systems which are both accurate, efficient and extractable by simple ...
Canavero, Flavio +8 more
core +1 more source
Wafer-Level Characterization and Monitoring Platform for Single-Photon Avalanche Diodes
IEEE Journal of the Electron Devices SocietyWhen developing a technology based on single-photon avalanche diodes (SPADs), the SPAD characterization is mandatory to debug, optimize and monitor the microfabrication process.
Samuel Parent +11 more
doaj +1 more source
Applied Surface Science Advances, 2020 This paper reports development and performance evaluation of room temperature operated Mercury Cadmium Telluride (HgCdTe) colloidal quantum dot (CQD) coated Si Readout Integrated Circuit (ROIC) based Infrared (IR) Focal Plane Array (FPA).
Abhijit Chatterjee +3 more
doaj +1 more source
Ring oscillator clocks and margins [PDF]
, 2016 How much margin do we have to add to the delay lines of a bundled-data circuit? This paper is an attempt to give a methodical answer to this question, taking into account all sources of variability and the existing EDA machinery for timing analysis and ...
Cortadella, Jordi +4 more
core +1 more source
GaSb-based integrated lasers and photodetectors on a silicon-on-insulator waveguide circuit for sensing applications in the shortwave infrared [PDF]
, 2012 We report our results on GaSb photodiodes and lasers integrated on a Silicon-On-Insulator waveguide circuit. The photodiodes operate at room temperature with 0.4A/W responsivity for grating-assisted coupling and >1 A/W for an evanescent design.
Cerutti, L +5 more
core +1 more source
Correlation between pattern density and linewidth variation in silicon photonics waveguides [PDF]
, 2020 We describe the correlation between the measured width of silicon waveguides fabricated with 193 nm lithography and the local pattern density of the mask layout.
Bogaerts, Wim +3 more
core +1 more source
Micromachines, 2021 Polymer materials attract more and more interests for a biocompatible package of novel implantable medical devices. Medical implants need to be packaged in a biocompatible way to minimize FBR (Foreign Body Reaction) of the implant.
Seonho Seok
doaj +1 more source
Mismatch distance term compensation in centroid configurations with nonzero-area devices [PDF]
, 1997 This paper presents an analytical approach to distance term compensation in mismatch models of integrated devices. Firstly, the conditions that minimize parameter mismatch are examined under the assumption of zero-area devices.
Fernández Fernández, Francisco Vidal +2 more
core +1 more source
The integration of on-line monitoring and reconfiguration functions using IEEE1149.4 into a safety critical automotive electronic control unit. [PDF]
, 2005 This paper presents an innovative application of IEEE 1149.4 and the integrated diagnostic reconfiguration (IDR) as tools for the implementation of an embedded test solution for an automotive electronic control unit, implemented as a fully integrated ...
Cutajar, R. +5 more
core +1 more source
Micromachines, 2018 Thermocompression bonding for wafer-level hermetic packaging was demonstrated at the lowest temperature of 370 to 390 °C ever reported using Al films with thin Sn capping or insertions as bonding layer.
Shiro Satoh +3 more
doaj +1 more source