Results 31 to 40 of about 127,361 (299)
Fast LDO Handles a Wide Range of Load Currents and Load Capacitors, up to 100 mA and Over 1μF
IEEE Access, 2022 This paper proposes a low dropout voltage regulator (LDO) that exhibits both a fast response to load transients and the ability to handle practically any load capacitor.
Alina-Teodora Grajdeanu +5 more
doaj +1 more source
Characterization of an embedded RF-MEMS switch [PDF]
, 2010 An RF-MEMS capacitive switch for mm-wave integrated circuits, embedded in the BEOL of 0.25μm BiCMOS process, has been characterized. First, a mechanical model based on Finite-Element-Method (FEM) was developed by taking the residual stress of the thin ...
Ehwald, K. E. +10 more
core +1 more source
An 8.72 µW Low-Noise and Wide Bandwidth FEE Design for High-Throughput Pixel-Strip (PS) Sensors
Sensors, 2021 The front-end electronics (FEE) of the Compact Muon Solenoid (CMS) is needed very low power consumption and higher readout bandwidth to match the low power requirement of its Short Strip application-specific integrated circuits (ASIC) (SSA) and to handle
Folla Kamdem Jérôme +6 more
doaj +1 more source
Ring oscillator clocks and margins [PDF]
, 2016 How much margin do we have to add to the delay lines of a bundled-data circuit? This paper is an attempt to give a methodical answer to this question, taking into account all sources of variability and the existing EDA machinery for timing analysis and ...
Cortadella, Jordi +4 more
core +1 more source
Micromachines, 2021 Polymer materials attract more and more interests for a biocompatible package of novel implantable medical devices. Medical implants need to be packaged in a biocompatible way to minimize FBR (Foreign Body Reaction) of the implant.
Seonho Seok
doaj +1 more source
Low-power, low-penalty, flip-chip integrated, 10Gb/s ring-based 1V CMOS photonics transmitter [PDF]
, 2013 Modulation with 7.5dB transmitter penalty is demonstrated from a novel 1.5Vpp differential CMOS driver flip-chip integrated with a Si ring modulator, consuming 350fJ/bit from a single 1V supply at bit rates up to 10Gb ...
Absil, P +10 more
core +1 more source
Validation by Measurements of a IC Modeling Approach for SiP Applications [PDF]
, 2011 The growing importance of signal integrity (SI) analysis in integrated circuits (ICs), revealed by modern systemin-package methods, is demanding for new models for the IC sub-systems which are both accurate, efficient and extractable by simple ...
Canavero, Flavio +8 more
core +1 more source
Wafer-Level Characterization and Monitoring Platform for Single-Photon Avalanche Diodes
IEEE Journal of the Electron Devices SocietyWhen developing a technology based on single-photon avalanche diodes (SPADs), the SPAD characterization is mandatory to debug, optimize and monitor the microfabrication process.
Samuel Parent +11 more
doaj +1 more source
(Invited) mm-wave silicon ICs: An opportunity for holistic design [PDF]
, 2008 Millimeter-waves integrated circuits offer a unique opportunity for a holistic design approach encompassing RF, analog, and digital, as well as radiation and electromagnetics.
Hajimiri, Ali
core +1 more source
Micromachines, 2018 Thermocompression bonding for wafer-level hermetic packaging was demonstrated at the lowest temperature of 370 to 390 °C ever reported using Al films with thin Sn capping or insertions as bonding layer.
Shiro Satoh +3 more
doaj +1 more source