Results 211 to 220 of about 91,789 (247)
Some of the next articles are maybe not open access.
Diffusion bonding through interlayers
Welding International, 2013Studies of the application of interlayers in diffusion bonding (DB) are reviewed. A method for the classification of these layers for DB of dissimilar materials is proposed. The role of the interlayers and their contribution to the formation of the joint in all stages of bonding are investigated.
G.M. Zeer +4 more
openaire +1 more source
Journal of Materials Science, 1984
The diffusion bonding of copper is studied experimentally and the results are compared with the predictions of a model of the bonding process. The dominant bonding mechanism is shown to be the power-law creep deformation of contacting surface asperities at high surface roughnesses.
Derby, B., Wallach, E. R.
openaire +1 more source
The diffusion bonding of copper is studied experimentally and the results are compared with the predictions of a model of the bonding process. The dominant bonding mechanism is shown to be the power-law creep deformation of contacting surface asperities at high surface roughnesses.
Derby, B., Wallach, E. R.
openaire +1 more source
Intermetallics, 1993
Abstract Diffusion-bonding of TiAl (48 at.% Al) using both solid-state and transient-liquid-phase (TLP) processes was studied. In solid-state diffusion-bonding, dynamic recrystallization which occurs at the bond-line during bonding is found to have a significant effect on improving bond strength.
P. Yan, E.R. Wallach
openaire +1 more source
Abstract Diffusion-bonding of TiAl (48 at.% Al) using both solid-state and transient-liquid-phase (TLP) processes was studied. In solid-state diffusion-bonding, dynamic recrystallization which occurs at the bond-line during bonding is found to have a significant effect on improving bond strength.
P. Yan, E.R. Wallach
openaire +1 more source
Alumina-Copper Diffusion Bonding
2008Etude du soudage alumine-cuivre par interdiffusion dans les conditions de pressage a haute temperature. On examine les effets de la temperature, de la duree de pressage, de la pression, de l'environnement, de la vitesse de refroidissement et de la relaxation des contraintes lors du ...
R. M. Crispin, M. G. Nicholas
openaire +1 more source
Diffusion bonding: development of theoretical model
Metal Science, 1984In previous work, a theoretical model for solid state diffusion bonding was described. The vapor phase mass transport rate equations are now derived. In addition, a revised model is presented for the power law creep mechanism based on considerations of the elastic and plastic deformation of a long triangular ridge.
Derby, B., Wallach, E. R.
openaire +2 more sources
Diffusion bonding of A2017 aluminium alloy
Welding International, 1990Diffusion bonding is a solid phase welding process in which bonding occurs through coalescence of the surfaces in contact. The principal operating parameters of diffusion bonding are the temperature, pressure and the bonding time. In addition to diffusion, other mechanisms such as microscopic creep or recrystallization also contribute to the formation ...
T. Latouche +3 more
openaire +1 more source
1991
There is currently great interest in the process of diffusion bonding. The main thrust has been in the joining of advanced materials such as superplastic alloys, metal matrix composites and ceramics and, most importantly, to introduce the process into mass-production operations.
openaire +1 more source
There is currently great interest in the process of diffusion bonding. The main thrust has been in the joining of advanced materials such as superplastic alloys, metal matrix composites and ceramics and, most importantly, to introduce the process into mass-production operations.
openaire +1 more source
Joining III: Diffusion Bonding
1979Diffusion bonding is another process available to the designer for the joining of beryllium. With this process, joining of clean, closely fitting parts is obtained by the application of heat and pressure. The coalescence of the base metal is achieved through atomic transport and mechanical processes at the bonding interface.
D. L. Olson, A. L. Liby
openaire +1 more source
Acoustic harmonic generation at diffusion bonds
Journal of Nondestructive Evaluation, 1997The distortion of a sinusoidal acoustic wave at unbonded interfaces has been determined in terms of the first and second harmonic amplitudes. The results demonstrate for the first time that the second harmonic can reach the theoretically predicted maximum value.
D. J. Barnard +3 more
openaire +1 more source
Fundamentals of Diffusion Bonding
1993Abstract Diffusion bonding is only one of many solid-state joining processes wherein joining is accomplished without the need for a liquid interface (brazing) or the creation of a cast product via melting and resolidification. This article offers a qualitative summary of the theory of diffusion bonding.
Murray W. Mahoney, Cliff C. Bampton
openaire +1 more source