Results 41 to 50 of about 91,789 (247)
Low-Temperature Diffusion of Au and Ag Nanolayers for Cu Bonding
With the recent rapid development of IT technology, the demand for multifunctional semiconductor devices capable of high performance has increased rapidly, and the miniaturization of such devices has also faced limitations. To overcome these limitations,
Sangmin Lee +2 more
doaj +1 more source
Rethinking plastic waste: innovations in enzymatic breakdown of oil‐based polyesters and bioplastics
Plastic pollution remains a critical environmental challenge, and current mechanical and chemical recycling methods are insufficient to achieve a fully circular economy. This review highlights recent breakthroughs in the enzymatic depolymerization of both oil‐derived polyesters and bioplastics, including high‐throughput protein engineering, de novo ...
Elena Rosini +2 more
wiley +1 more source
Enzymatic degradation of biopolymers in amorphous and molten states: mechanisms and applications
This review explains how polymer morphology and thermal state shape enzymatic degradation pathways, comparing amorphous and molten biopolymer structures. By integrating structure–reactivity principles with insights from thermodynamics and enzyme engineering, it highlights mechanisms that enable efficient polymer breakdown.
Anđela Pustak, Aleksandra Maršavelski
wiley +1 more source
Similar and dissimilar material joints of AISI grade 304 (1.4301) and AISI grade 316 (1.4401) austenitic stainless steel by solid state diffusion bonding and transient liquid phase (TLP) bonding are of interest to academia and industry alike. Appropriate
Abdulaziz AlHazaa, Nils Haneklaus
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Unique biological samples, such as site‐specific mutant proteins, are available only in limited quantities. Here, we present a polarization‐resolved transient infrared spectroscopy setup with referencing to improve signal‐to‐noise tailored towards tracing small signals. We provide an overview of characterizing the excitation conditions for polarization‐
Clark Zahn, Karsten Heyne
wiley +1 more source
Unraveling diffusion behavior in Cu-to-Cu direct bonding with metal passivation layers
Cu/SiO2 hybrid bonding presents a promising avenue for achieving high-density interconnects by obviating the need for microbumps and underfills. Traditional copper bonding methods often demand temperatures exceeding 400 °C, prompting recent endeavors to ...
Min Seong Jeong +6 more
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6063 aluminum alloy is often used in the manufacture of microchannel heat exchangers, which are formed by diffusion bonding to connect laminates, and diffusion bonding is a key technology that determines the production quality.
Jiafen Song +5 more
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Evolutionarily divergent DUF4465 domains have a common vitamin B12‐binding function
We show that DUF4465 family proteins, widespread across bacteria from gut microbiomes, hydrothermal vents, and soil, share a common vitamin B12‐binding function. These augmented β‐jellyroll proteins bind vitamin B12 via extended loops. Our findings establish sequence‐diverse DUF4465 proteins as a widespread class of B12‐binding proteins, highlighting ...
Charlea Clarke +4 more
wiley +1 more source
The present work deals with direct diffusion bonding welding without interlayer of austenitic stainless steel type AISI 304L with Oxygen Free High Conductivity pure copper (OFHC) in vacuum atmosphere (1.5 *10-5 mbr.).
Sami Abualnoun Ajeel +2 more
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Computational Study on Surface Bonding Based on Nanocone Arrays
Surface bonding is an essential step in device manufacturing and assembly, providing mechanical support, heat transfer, and electrical integration. Molecular dynamics simulations of surface bonding and debonding failure of copper nanocones are conducted ...
Xiaohui Song, Shunli Wu, Rui Zhang
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