Results 51 to 60 of about 295,302 (310)
Microstructural Evolution in Nonvacuum Solid-State Diffusion Bonded Joints of AA2219
Advances in Materials Science and Engineering, 2023 Solid-state diffusion bonding of AA2219 alloy is carried out under the nonvacuum condition to form AA2219/AA2219 joints. In the currently adopted method, AA2219 alloys are joined under the bonding temperature of 450–500°C, bonding pressure of 10 MPa, and
Manjunath Vatnalmath +5 more
doaj +1 more source
Gold in graphene: in-plane adsorption and diffusion
, 2008 We study the bonding and diffusion of Au in graphene vacancies using density-functional theory. Energetics show that Au adsorbs preferably to double vacancies, steadily in-plane with graphene.
Häkkinen, H., Koskinen, P., Malola, S.
core +1 more source
Evolutionarily divergent DUF4465 domains have a common vitamin B12‐binding function
FEBS Open Bio, EarlyView.We show that DUF4465 family proteins, widespread across bacteria from gut microbiomes, hydrothermal vents, and soil, share a common vitamin B12‐binding function. These augmented β‐jellyroll proteins bind vitamin B12 via extended loops. Our findings establish sequence‐diverse DUF4465 proteins as a widespread class of B12‐binding proteins, highlighting ...
Charlea Clarke +4 more
wiley +1 more source
Thoriated nickel bonded by solid-state diffusion method [PDF]
, 1965 Solid-state diffusion bonding in an inert-gas atmosphere forms high-strength joints between butting or overlapping surfaces of thoriated nickel.
Bales, T. T., Manning, R. C., Jr.
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Epilepsy‐Associated Variants of a Single SCN1A Codon Exhibit Divergent Functional Properties
Annals of Clinical and Translational Neurology, EarlyView.ABSTRACT Objective Pathogenic variants in SCN1A, which encodes the voltage‐gated sodium channel NaV1.1, are associated with multiple epilepsy syndromes exhibiting a range of clinical severity. SCN1A variants are reported in different syndromes, including Dravet syndrome, which is associated with loss‐of‐function, whereas neonatal/infantile‐onset ...
Lanie N. Liebovitz +3 more
wiley +1 more source
Unraveling diffusion behavior in Cu-to-Cu direct bonding with metal passivation layers
Scientific ReportsCu/SiO2 hybrid bonding presents a promising avenue for achieving high-density interconnects by obviating the need for microbumps and underfills. Traditional copper bonding methods often demand temperatures exceeding 400 °C, prompting recent endeavors to ...
Min Seong Jeong +6 more
doaj +1 more source
Journal of Materials Research and Technology6063 aluminum alloy is often used in the manufacture of microchannel heat exchangers, which are formed by diffusion bonding to connect laminates, and diffusion bonding is a key technology that determines the production quality.
Jiafen Song +5 more
doaj +1 more source
مجلة النهرين للعلوم الهندسية, 2018 The present work deals with direct diffusion bonding welding without interlayer of austenitic stainless steel type AISI 304L with Oxygen Free High Conductivity pure copper (OFHC) in vacuum atmosphere (1.5 *10-5 mbr.).
Sami Abualnoun Ajeel +2 more
doaj +1 more source
Initial stages of Pt growth on Ge(001) studied by scanning tunneling microscopy and density functional theory [PDF]
, 2004 We have studied the initial stages of submonolayer Pt growth on the Ge(001). We have observed several stable and meta-stable adsorption configurations of Pt atoms at various temperatures. Calculations indicate relatively high binding energies of Pt atoms
Ciraci, S. +4 more
core +3 more sources
Advanced Engineering Materials, Volume 27, Issue 6, March 2025.The stability criteria affecting the formation of high‐entropy alloys, particularly focusing in supersaturated solid solutions produced by mechanical alloying, are analyzed. Criteria based on Hume–Rothery rules are distinguished from those derived from thermodynamic relations. The formers are generally applicable to mechanically alloyed samples.
Javier S. Blázquez +5 more
wiley +1 more source