Results 71 to 80 of about 295,302 (310)
High-integrity diffusion bonding of laser powder bed fused, forged, and rolled Ti–6Al–4V alloys
Journal of Materials Research and TechnologyDiffusion bonding of additively manufactured Ti–6Al–4V components with complex geometries to conventionally processed frames is a cost-effective approach for reducing the buy-to-fly ratio while minimizing deformation.
Seoyeon Jeon +6 more
doaj +1 more source
Materials Research Express, 2020 Diffusion bonding of titanium (Ti) to 17-4 PH high strength stainless steel is challenging owing to the formation of brittle Ti-Fe intermetallic compounds (IMCs) at joint interface.
Bo Feng +4 more
doaj +1 more source
Method of fluxless brazing and diffusion bonding of aluminum containing components [PDF]
, 1976 A method of diffusion bonding and fluxless brazing of aluminum containing components is reported. The aluminum surfaces are freed of any aluminum oxide coating and are coated with a polymeric sealer which can be thermally removed leaving essentially no ...
Featherston, A. B., Okelly, K. P.
core +1 more source
Packaging of Macroscopic Material Payloads: Needs, Challenges, Concepts, and Future Directions
Advanced Engineering Materials, EarlyView.This review introduces a unified framework that decomposes any macroscopic packaging system into the payload, packaging material, and packaging strategy and combines them into a conceptual packaging equation: packaging strategy = payload + packaging material.
Venkata S. R. Jampani, Manos Anyfantakis
wiley +1 more source
Advanced Engineering Materials, EarlyView.High‐temperature interactions between low‐sulfur Al‐killed Mn–B steel and MgO–C refractories (0 and 50 wt% recyclates) are studied via finger immersion tests (1600 °C). Surface‐active elements influence infiltration. MgO/CaS layer forms, along with spinel and calcium silicate.
Matheus Roberto Bellé +5 more
wiley +1 more source
Numerical Modelling of Void Closure Diffusion Model
Materials ProceedingsA void closure analytic model for the diffusion bonding of titanium TC4 alloy is developed in this study, in which an FEA-based deformation mechanism is coupled with a numerical analysis for diffusion. The focus was to evaluate the effect of pressure and
Muhammad Akif +3 more
doaj +1 more source
Thermal stability of titanium nitride for shallow junction solar cell contacts [PDF]
, 1981 To demonstrate the thermal stability of titanium nitride as a high-temperature diffusion barrier, the TiN-Ti-Ag metallization scheme has been tested on shallow-junction (~2000 Å) Si solar cells. Electrical measurements on reference samples with the Ti-Ag
Cheung, N. W. +4 more
core +1 more source
Zein‐Based Adhesives: Sustainable Extraction and Application in Bioadhesive Technologies
Advanced Engineering Materials, EarlyView.Zein is extracted from corn gluten meal using a simple and scalable process with high yield (~90%). The resulting protein is applied in bioadhesives modified with Ca2+ and Fe3+ ions, exhibiting substrate‐dependent adhesion. The findings demonstrate competitive bonding performance and highlight the role of ionic interactions in tuning adhesion ...
Paula Bertolino Sanvezzo +3 more
wiley +1 more source
Vacuum Diffusion Bonding of Dissimilar Metal Alloys AA2219 and Ti-6Al-4V: Influence of Bonding Pressure on Microstructure and Mechanical Properties of the Bonding Joint [PDF]
Iranian Journal of Materials Science and EngineeringDissimilar joints of AA2219 and Ti-6Al-4V alloys are obtained using the vacuum diffusion bonding method. The bonding pressure is controlled in the range of 1-4 MPa by keeping the bonding temperature and holding time constant. The influence of the bonding
Manjunath Vatnalmath +6 more
doaj
Advanced Engineering Materials, EarlyView.It is shown that laser ablation pretreatment under oxygen‐free conditions enables copper–aluminium bonding at significantly lower deformation degrees and improved properties compared to mechanical brushing. Laser ablation further increases interface contact area and induces favourable residual stress states and microstructural compatibility ...
Khemais Barienti +11 more
wiley +1 more source