Results 71 to 80 of about 91,789 (247)
The growing demand for lightweight, nontoxic, and multifunctional gamma shielding materials has intensified efforts to find alternatives to conventional lead and aluminum‐based protectants. In this work, we develop epoxy quartz fabric composites reinforced with cobalt chloride (CoCl2) microparticles, fabricated via hand lay‐up with varying filler ...
Summan Urooge +7 more
wiley +1 more source
Laser Metal Powder Deposition of Titanium Microalloyed HSLA Steel FeC0.12Si0.25Mn1.3
This study investigates the additive manufacturing of titanium‐doped high‐strength low‐alloy (HSLA) steel via laser metal deposition. It reveals distinct process‐structure relationships for elemental powder blends compared to prealloyed feedstocks.
Olaf Stelling +2 more
wiley +1 more source
Optimization of Diffusion Bonding of Pure Copper (OFHC) with Stainless Steel 304L
This work deals with determination of optimum conditions of direct diffusion bonding welding of austenitic stainlesssteel type AISI 304L with Oxygen Free High Conductivity (OFHC) pure copper grade (C10200) in vacuum atmosphere of (1.5 *10-5 mbr.).
Ahmed Ali Akbar Akbar +2 more
doaj +1 more source
3D‐Printed Giant Magnetoresistive (GMR) Sensors Based on Self Compliant Springs
This work explores 3D‐printed GMR sensors utilizing self‐compliant spring structures and conductive PLA composites. By optimizing arm width, we achieved high piezoresistive (0.34%/mm) and magnetoresistive (0.77%/mT) sensitivities. Demonstrated through Bluetooth‐integrated pressure and magnetic position sensing, these full printed low‐cost, customizable
Josu Fernández Maestu +4 more
wiley +1 more source
Austenitic stainless steel diffusion bonding was performed, and the effects of the surface roughness and bonding temperature on the interface microstructure and mechanism of hole closure were investigated. The bonded interface microstructure was analyzed.
Yanni Wei +4 more
doaj +1 more source
A Review on Recent Advances in Transient Liquid Phase (TLP) Bonding for Thermoelectric Power Module
In this study, the authors have reviewed recent advances on the transient liquid phase (TLP) bonding technology for various applications especially power module packaging in view of the recent increasing demand for the production of vehicles, smartphones,
Jung D. H. +3 more
doaj +1 more source
Electrical Conductivities of Conductors, Semiconductors, and Their Mixtures at Elevated Temperatures
This article presents a comprehensive review of temperature‐dependent electrical conductivity data for multiple material classes at elevated temperatures, highlighting a persistent conductivity gap between metals and semiconductors in the range of 102$\left(10\right)^{2}$– 107$\left(10\right)^{7}$ S/m. Metal–ceramic irregular metamaterials are proposed
Valentina Torres Nieto, Marcia A. Cooper
wiley +1 more source
The formation of nonmetallic inclusions (NMIs) was investigated in this study, carrying out immersion tests for 30 min at a temperature of 1600°C with liquid high‐silicon electrical steel (Si ≈ 3 mass‐%) and different MgO–C refractories. Conventional MgO–C refractories were considered, as well as MgO–C refractories containing MgO–C recyclate and ...
Lukas Neubert +6 more
wiley +1 more source
This study investigates laser‐based oxide removal of Cu inserts in oxygen‐free conditions and examines long‐term oxidation kinetics and surface chemistry under different atmospheres via X‐ray photoelectron spectroscopy. Al–Cu compound casting with differently oxidized surfaces is performed, and intermetallic phase formation, morphology, and thermal ...
Timon Steinhoff +9 more
wiley +1 more source
The wettability of aluminum droplets (Al) on different copper substrates (Cu), where liquid Al spreads on solid Cu surfaces to form a liquid–solid interface, is studied numerically and experimentally. The experimental and numerical results show good agreement in the fast‐spreading regime.
Shan Lyu +8 more
wiley +1 more source

