Results 181 to 190 of about 1,029 (198)

Enhancing WPE for AlGaN-based DUV LEDs using a hybrid heterostructure and recessed electrodes design

Optics Letters
One of the key factors limiting the wall-plug efficiency (WPE) of AlGaN-based deep-ultraviolet (DUV) light-emitting diodes (LEDs) is the high voltage drop over the n-contact on the Al-rich n-AlGaN. Here, we have proposed a hybrid scheme of n-AlGaN heterostructure and recessed cathodes to optimize the n-contact.
Yuxuan Chen, Ke Jiang, Bingxiang Wang, Kexi Liu, Xianjun Wang, Shanli Zhang, Shunpeng Lu, Yang Chen, Yuping Jia, Mingrui Liu, Xiaojuan Sun, Dabing Li   +11 more
openaire   +2 more sources

DUV-LED packaging using high density TSV in silicon cavity and laser-glass-frit-bonded UV transmitting glass cap

Sensors and Actuators A: Physical, 2022
Yukio Suzuki, Shuji Tanaka
exaly  

High Performance of a Non-Polar AlGaN-Based DUV-LED with a Quaternary Superlattice Electron Blocking Layer

Journal of Electronic Materials, 2022
Qian Dai, Xiong Zhang, Xianghua Zeng
exaly  

Semi-inorganic Packaging Technology of DUV-LEDs with High-vapor Tightness

Chinese Journal of Luminescence, 2023
Chuiming WAN, Zhaoming ZENG, Guowei XIAO, Yian LAN, Zijing XIE, Hong WANG   +5 more
openaire   +1 more source

Characterization of Oxide Layers on AlGaN Based DUV LEDs by TEM/STEM Analysis

2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2022
Jong-Shing Bow, Jay Wang, Wei-Chih Lai, Tien-Yu Wang, Syuan-Yu Sie, Sheng-Po Chang, Cheng-Huang Kuo, Jinn-Kong Sheu   +7 more
openaire   +1 more source

Tunnelling assisted by Si-doped n-AlGaN layer on the p-side of 254 nm DUV LED

Optical and Quantum Electronics, 2023
M Ajmal Khan, Malika Rani, Liu Yuhuai
exaly  

Light extraction structure formation process in DUV-LEDs

Gallium Nitride Materials and Devices XXI
Yoshio Honda, Ryoko Tsukamoto, Shun Lu, Yuta Furusawa, Shinya Boyama, Atsushi Miyazaki, Maki Kushimoto, Hiroshi Amano, Yoshiki Saito   +8 more
openaire   +1 more source

High Light Power Density DUV-LED Packaging Using High Density TSV in Silicon Cavity and Laser-Glass-Frit-Bonded Glass Cap

2021
Yukio Suzuki, Shuji Tanaka
exaly  

Reliability Modeling of High Power DUV LED Chips Based on New Thin Film Packaging Technology

2023
Xin Tan, Haitao Ma, Hongwei Liang
exaly  

Improving the light output power of DUV-LED by introducing an intrinsic last quantum barrier interlayer on the high-quality AlN template

Solid-State Electronics, 2017
Chia-Lung Tsai, Jun-Wei Chen, Kazutada Ikenaga   +2 more
exaly