Results 81 to 90 of about 1,497,050 (340)

Robocasting of a Water‐Based Biopolymer/WO3 Nanopowder Paste as a Precursor to Tungsten Carbide Lattices

Advanced Engineering Materials, EarlyView.
This study demonstrates a novel, additive manufacturing approach to produce complex, porous tungsten carbide structures using water‐based direct ink writing/robocasting. Leveraging a modified commercial printer and heat treatment, the process yields lightweight, electrically conductive 3D architectures capable of supporting a mechanical load.
James Bentley Bevis, Manasi Shah, Sanketh Gombi, Rodrigo Martinez‐Duarte   +3 more
wiley   +1 more source

Wafer Bonding Technologies for Microelectromechanical Systems and 3D ICs: Advances, Challenges, and Trends

Advanced Engineering Materials, EarlyView.
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan, Tuan‐Khoa Nguyen, Quang Thang Trinh, Nam‐Trung Nguyen, Dzung Viet Dao, Yong Zhu   +5 more
wiley   +1 more source

Optimized Strategy for Fabricating High‐Aspect‐Ratio Periodic Structures Over Large Areas Using ps‐Direct Laser Interference Patterning

Advanced Engineering Materials, EarlyView.
Picosecond direct laser interference patterning (DLIP) enables precise microstructure fabrication on stainless steel. Using a multiscan approach, high‐aspect‐ratio patterns are achieved. Fluence influences structure growth and homogeneity, with smaller periods yielding better uniformity.
Fabian Ränke, Marcelo Sallese, Marcos Soldera, Ignacio Tabares, Flavio Soldera, Andrés Fabián Lasagni   +5 more
wiley   +1 more source

Sol–Gel Synthesis of Ca2.5Ag0.3Sm0.2Co4O9 Semiconducting Materials for Thermoelectric Applications in Aerospace Systems

Advanced Engineering Materials, EarlyView.
Ca2.5Ag0.3Sm0.2Co4O9 semiconductor materials are synthesized and produced in this study using the sol–gel and cold pressing techniques for thermoelectric generator applications. As template samples are added, the Seebeck coefficient and power factor values rise, peaking at 800 °C for Ca2.5Ag0.3Sm0.2Co4O9 at 274.47 μV K−1 and 0.58 mW mK−2, respectively.
Enes Kilinc, Fatih Uysal, Mucahit Abdullah Sari, Huseyin Kurt, Erdal Celik   +4 more
wiley   +1 more source

Titanium‐S23: A New Alloy with Ultra‐High Tensile Toughness Directly from the Solid‐State Processing of Recycled Ti–6Al–4V and Ti–5Al–5Mo–5V–3Cr Powders using Field Assisted Sintering Technology

Advanced Engineering Materials, EarlyView.
This study explores combining two existing aerospace titanium alloy powders, processing them via field‐assisted sintering technology and the subsequent discovery of a novel alloy composition, termed S23, with ultra‐high tensile toughness. Fine‐scale alpha precipitates favorably form in the alloy despite the relatively slow cooling, providing an ...
Samuel Lister, Gavin J. Baxter, Martin Jackson   +2 more
wiley   +1 more source

New Developments in the Field of Production and Application of Multi‐Material Wire Arc Additive Manufacturing Components: A Review

Advanced Engineering Materials, EarlyView.
The utilization of direct energy deposition (DED)‐arc additive manufacturing processes in industrial applications is increasing, and these processes have the potential for multi‐material applications. This work provides a overview of the state of research in DED‐arc made functional graded structures, to establish a link to potential industrial ...
Kai Treutler, Volker Wesling
wiley   +1 more source

Investigation of agglomeration and sedimentation of PEFC electrode slurries by a laminated microfluidic device

Nihon Kikai Gakkai ronbunshu, 2020
A film-laminated microfluidic device was fabricated to analyze an electrode slurry used to form a porous electrode of polymer electrolyte fuel cells, and sorting of particles in the slurry was demonstrated.
Takahiro SUZUKI, Mizuki DOI, Yuki SHIMIZU, Toshihide TADENUMA, Shohji TSUSHIMA   +4 more
doaj   +1 more source

Neuroelectronic interfacing with cultured multielectrode arrays toward a cultured probe [PDF]

, 2001
Efficient and selective electrical stimulation and recording of neural activity in peripheral, spinal, or central pathways requires multielectrode arrays at micrometer scale.
Buitenweg, Jan, Heida, Ciska, Lakke, Egbert, Marani, Enrico, Mouveroux, Jean-Marie, Ruardij, Teun, Rutten, Wim   +6 more
core   +3 more sources

High‐Resolution Reverse Offset Printed Electroluminescent Multipixel Arrays for Scalable Future Wearable Displays

Advanced Engineering Materials, EarlyView.
This study explores the effects of pixel size and spacing when fabricating electroluminescent (EL) multipixel displays. COMSOL simulations identify the impact of pixel dimensions and spacing on electric field distribution and lighting efficiency. Flexible, high‐resolution EL pixel arrays are reverse offset printed, achieving a 96% reduction in pixel ...
Huanghao Dai, Yuxin Xia, Steve Beeby, Russel Torah   +3 more
wiley   +1 more source

Integral skin electrode for electrocardiography is expendable [PDF]

, 1966
Inexpensive, expendable skin electrode for use in electrocardiography combines an electrical contact, conductive paste, and a skin-attachment adhesive.

core   +1 more source