Water-cooled electronics [PDF]
Abstract LHC experiments demand on cooling of electronic instrumentation will be extremely high. A large number of racks will be located in underground caverns and counting rooms, where cooling by conventional climatisation would be prohibitively expensive.
G. Dumont +2 more
openaire +1 more source
Miniature vapor compression refrigeration system for electronics cooling
A miniature vapor compression refrigeration system using R134a is investigated for electronics cooling. The system consists of four main components: an evaporator, a compressor, a capillary tube, and a condenser.
Akasit Poachaiyapoom +3 more
doaj +1 more source
HTS pulse-stretcher and second order modulator: design and first results [PDF]
One of the remaining challenges in the application of superconducting electronics is the interfacing between superconducting and semiconducting environments. The voltage and speed mismatch between RSFQ pulses and semiconducting read-out electronics makes
Brinkman, Alexander +8 more
core +2 more sources
Probing the sheath electric field with a crystal lattice by using thermophoresis in dusty plasma [PDF]
A two-dimensional dust crystal levitated in the sheath of a modified Gaseous Electronics Conference (GEC) reference cell is manipulated by heating or cooling the lower electrode.
Hyde, Truell +3 more
core +1 more source
Numerical investigation of single and multiple impinging synthetic jets on the flow field and heat transfer at low orifice-to-plate distances [PDF]
In the present numerical study, the thermal performance and fluid flow properties have been investigated to show the effect of single-orifice and multiple-orifice impingement of synthetic jets for dimensionless orifice-toplate distance (H/D) of lower ...
Ergur Eda, Calisir Tamer
doaj +1 more source
Experimental investigation of direct contact baseplate cooling for electric vehicle power electronics [PDF]
An experimental setup has been built to investigate the thermo-hydraulic performance of the direct contact baseplate cooling technique for power electronics in electric vehicles, to improve the design and to validate the modelling of this technique.
De Paepe, Michel +4 more
core +1 more source
Optimization of heat sinks with plate fins in air-jet cooling
Heat density of high-load electronics such as high-performance servers and the inverters used in vehicles has been increasing as the result of higher processing speeds and computational scale, and higher output, etc.
Takayuki ATARASHI +2 more
doaj +1 more source
A Novel Manifold Dual-Microchannel Flow Field Structure with High-Performance Heat Dissipation
With the development of miniaturization and integration of electronic devices, the conventional manifold microchannels (MMCs) structure has been unable to meet the heat dissipation requirements caused by the rapid growth of internal heat flux.
Xing Yang +9 more
doaj +1 more source
Comparisons between heat pipe, thermoelectric system, and vapour compression refrigeration system for electronics cooling [PDF]
Passive systems such as air for electronics cooling have now effectively reached their limits. This paper evaluated three comparable systems for electronics cooling, including heat pipe (HP, passive system), thermoelectric (TE) and vapour compression ...
Chen, Ming +3 more
core +1 more source
Electron cooling experiments in CSR [PDF]
5 pages 11 ...
XiaoDong Yang +10 more
openaire +2 more sources

