Results 11 to 20 of about 1,206,791 (278)

Effect of Abrasive Particle Size on Lapping of Sapphire Wafer by Fixed Abrasive Pad

open access: yesKey Engineering Materials, 2018
The choice of abrasive particle size is crucial to improve the lapping efficiency and surface quality in lapping of sapphire wafer by fixed abrasive (FA) pad. A model for the penetration depth of a single abrasive is developed with fixed abrasive pad.
Jian Bin Wang   +4 more
openaire   +2 more sources

Research on Subsurface Damage After Abrasives and Fixed-Abrasive Lapping of K9 Glass

open access: yesKey Engineering Materials, 2011
Fixed-abrasive lapping (FAL) is a new machining technology and is adopted to manufacture hard brittle materials to obtain the high surface quality. In the same machining condition, K9 glasses are lapped by abrasives and fixed-abrasive, respectively. Two grain sizes of diamond abrasives are adopted in every lapping means.
Jun Li   +5 more
openaire   +2 more sources

Study on Lapping Process of 304 Stainless Steel Using Tribochemical Fixed-Abrasive Lapping Platen

open access: yesManufacturing Technology, 2022
Based on the previous research on the 304 stainless steel lapping and polishing in our research group, the tribochemical fixed-abrasive lapping platen for 304 stainless steel lapping and polishing were developed.
J. Su   +4 more
semanticscholar   +2 more sources

Optimal design and experimental study of fixed abrasive pads based on coupling of damping regulation and pellet arrangement [PDF]

open access: yesMechanical Sciences, 2021
Lapping and polishing technology is an efficient processing method for wafer planarization processing. The structure of the fixed abrasive pad (FAP) is one of the most concerning issues in the research. The FAP structure affects the pressure distribution
C. Xu, C. Fang, Y. Li, C. Liu
doaj   +1 more source

Lapping of Soft-Brittle Lithium Niobate Crystal with Fixed Abrasive Pad. [PDF]

open access: yesMaterials (Basel)
Lithium niobate (LiNbO3, LN) single crystal is widely used in optoelectronic fields due to its excellent performance. However, its low hardness, high brittleness, and strong anisotropy lead to low processing efficiency and poor surface quality. Hydrophilic fixed abrasive lapping technology was adopted for the thinning of LN wafers in this research. The
Zhu N, Gao X, Tang C, Chen J, Zhu Y.
europepmc   +2 more sources

Key Parameters In Loose Abrasive Machining [PDF]

open access: yes, 2010
Loose abrasive machining is discussed in this paper. Key parameters of loose abrasive machining such as lapping and polishing are reviewed under systematic view of manufacturing system. Currently, such parameters considered as tacit knowledge. Different
Arief, Ikhwan, Chen, Xun
core   +4 more sources

Parameter optimization by Taguchi Methods for finishing advanced ceramic balls using a novel eccentric lapping machine [PDF]

open access: yes, 2001
The final finishing process of advanced ceramic balls used in hybrid precision bearings constitutes two-thirds of the total manufacturing cost, and hence effective and economic finishing methods and processes are critical to their widespread application.
Kang, J, Hadfield, M
core   +1 more source

An Experimental Study on the Abrasive Machining Process of Electronic Substrate Material With A Novel Ultraviolet-Curable Resin Bond Diamond Lapping Plate

open access: yesIEEE Access, 2019
Sapphire is one of the most widely used electronic substrate materials in the industry. The manufacturing process of sapphire and such hard and brittle materials is extremely time and energy consuming because of their superior material properties in ...
Lei Guo   +5 more
doaj   +1 more source

The polishing process of advanced ceramic balls using a novel eccentric lapping machine [PDF]

open access: yes, 2005
The finishing process of advanced ceramic balls can be divided into two steps. The first step is lapping in which most of the stock from the ball is removed at a higher material removal rate.
Kang, J, Hadfield, M
core   +1 more source

Residual stress field of HIPed silicon nitride rolling elements [PDF]

open access: yes, 2002
The residual stress field of HIPed Si3N4 rolling elements were studied. Two kinds of HIPed Si3N4 ball blanks self-finished at different nominal lapping loads ranging from 1.3 to 10.87 kgf/ball and four kinds of commercially finished 1/2 in (12.7 mm ...
Kang, J, Tobe, S, Hadfield, M
core   +1 more source

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