Study on Wavelet Packet Energy Characteristics on Friction Signal of Lapping with the Fixed Abrasive Pad [PDF]
Micromachines, 2022 The surface condition of the fixed abrasive pad (FAP) has a significant impact on its machining performance, workpiece material removal rate (MRR), and surface roughness.
Zhankui Wang +5 more
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Effect of pad and slurry on fixed abrasive polishing of gallium oxide crystal [PDF]
Jin'gangshi yu moliao moju gongcheng, 2022 Gallium oxide crystal is one of the most representative fourth generation semiconductor materials with the advantages of high band gap, high voltage resistance and short absorption cutoff edge. It has broad application prospects.
WU Cheng +4 more
doaj +5 more sources
Study on the Preparation and Performance of Self-Regressive Fixed Abrasive Chemical Mechanical Polishing Pad [PDF]
Machines, 2022 Chemical mechanical polishing (CMP) technology is one of the key technologies to realize the global planarization of semiconductor wafer surfaces. With the increasing popularity and universality of its application, more and higher requirements are put ...
Jianguo Yao +4 more
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The effect of slurries on lapping performance of fixed abrasive pad for SiN ceramics [PDF]
Science Progress, 2020 In this paper, a series of experiments were carried out to explore the effect of slurry pH on materials removal rate (MRR) and surface quality in lapping of Si 3 N 4 ceramics wafers with fixed abrasive pad (FAP) using different slurries with different pH.
Wang Zhankui +5 more
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An Exploration of the Influence of Abrasive Water Jet Pressure on the Friction Signal Characteristics of Fixed Abrasive Lapping Quartz Glass Based on HHT [PDF]
Micromachines, 2023 Abrasive water jetting is an effective dressing method for a fixed abrasive pad (FAP) and can improve FAP machining efficiency and the impact of abrasive water jet (AWJ) pressure on the dressing effect; moreover, the machining state of FAP after dressing
Yanling Zheng +5 more
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Influences of Nonaqueous Slurry Components on Polishing 4H-SiC Substrate with a Fixed Abrasive Pad
Crystals, 2023 4H-SiC wafers are more likely to sustain a lower material removal rate (MRR) and severe subsurface damage in conventional chemical mechanical polishing (CMP) methods.
Jiyuan Zhong +6 more
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A Novel Noise Reduction Approach of Acoustic Emission (AE) Signals in the SiC Lapping Process on Fixed Abrasive Pads [PDF]
MicromachinesAcoustic emission (AE) technology has been widely utilized to monitor the SiC wafer lapping process. The root-mean-square (RMS) of the time–domain eigenvalues of the AE signal has a linear relationship with the material removal rate (MRR).
Jie Lin +10 more
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Optimal design and experimental study of fixed abrasive pads based on coupling of damping regulation and pellet arrangement [PDF]
Mechanical Sciences, 2021 Lapping and polishing technology is an efficient processing method for wafer planarization processing. The structure of the fixed abrasive pad (FAP) is one of the most concerning issues in the research. The FAP structure affects the pressure distribution
C. Xu, C. Fang, Y. Li, C. Liu
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On the impact of pad material ingredients on particulate wear emissions from disc brakes
Results in Engineering, 2023 Besides friction and wear, airborne particle emission has become a central parameter when evaluating disc brake performance due to its potential adverse health effects as component of ambient air pollution.
Francesco Varriale +4 more
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Polishing characteristics of micron particles aggregated by nanosilica
Journal of Advanced Mechanical Design, Systems, and Manufacturing, 2015 Colloidal silica slurry has been widely used in mirror finishing of various microelectronic materials, including Si wafer. However, in the last decade, there has been a tendency to replace the polishing slurry with fixed-abrasive pads because of ...
Qi GAO, Yasuhiro TANI, Gang DONG
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