Wear of Polishing Pad and Pattern Optimization of Fixed Abrasive Pad [PDF]
Advanced Materials Research, 2010 The polishing pad plays a significant role in the Chemical Mechanical Polishing (CMP) process and its wear influences the surface accuracy of the polished wafer. A new polishing pad wear model is introduced and the law of pad wear along the pad radius is discussed, thus a new FAP with optimized pattern is designed and prepared in order. The flatness of
Mao Li +4 more
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Process Parameter Modeling and Optimization of Abrasive Water Jet Dressing Fixed-Abrasive Pad Based on Box-Behnken Design. [PDF]
Materials (Basel), 2022 Clarifying the influence of the dress process parameters of the abrasive water jet on the dressing effect of fixed-abrasive pads (FAPs) is a prerequisite for online controllable dressing of abrasive water jets.
Wang Z +7 more
europepmc +2 more sources
A Novel Method of Adding Sucrose in Fixed Abrasive Pads for Self-Conditioning. [PDF]
ACS OmegaA method of self-conditioning a fixed abrasive pad via the dissolution of sugar in bonds was proposed. Self-conditioning means that pads can be dressed by themselves during lapping processing. Self-conditioning experiments were conducted on a series of sucrose resin-based fixed abrasive pads for the lapping of monocrystalline silicon wafers.
Ma F +6 more
europepmc +4 more sources
Lapping of Soft-Brittle Lithium Niobate Crystal with Fixed Abrasive Pad. [PDF]
Materials (Basel)Lithium niobate (LiNbO3, LN) single crystal is widely used in optoelectronic fields due to its excellent performance. However, its low hardness, high brittleness, and strong anisotropy lead to low processing efficiency and poor surface quality. Hydrophilic fixed abrasive lapping technology was adopted for the thinning of LN wafers in this research. The
Zhu N, Gao X, Tang C, Chen J, Zhu Y.
europepmc +2 more sources
Fixed Abrasive Pad with Self-conditioning in CMP Process [PDF]
Journal of the Korean Institute of Electrical and Electronic Material Engineers, 2005 Chemical mechanical polishing(CMP) process is essential technology to be applied to manufacturing the dielectric layer and metal line in semiconductor devices. It has been known that overpolishing in CMP depends on pattern selectivity as a function of density and pitch, and use of fixed abrasive pad(FAP) is one method which can improve the pattern ...
Boumyoung Park +6 more
openaire +1 more source
An analytical investigation of pad wear caused by the conditioner in fixed abrasive chemical–mechanical polishing [PDF]
, 2014 Fixed abrasive chemical–mechanical polishing (CMP) is an efficient surface finishing method. The non-uniformity of substrates after polishing is one of the most interesting things in current trends in research.
Zhong, Zhao Wei +2 more
core +1 more source
Research on removal function of fluid hydrodynamic fixed abrasive grinding
Journal of Advanced Research, 2020 Fluid hydrodynamic fixed abrasive grinding (FHFAG) is now evolving into a promising finishing method underpinning the major advances across grinding and lapping sciences.
Pengfei Liu, Dong Ming, Bin Lin
doaj +1 more source
Corrective Abrasive Polishing Processes for Freeform Surface [PDF]
, 2009 Traditionally, abrasive finishing process only focused on producing excellent surface finish on regular form shapes. Ever increasing demands in freeform features in aerospace, energy and medicine applications require abrasive finishing technology not ...
Chen, Xun
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Effects of chemical slurries on fixed abrasive chemical-mechanical polishing of optical silicon substrates [PDF]
, 2013 Chemical mechanical polishing (CMP) with fixed abrasive pad is an alternative machining method to loose abrasive lapping and partial polishing with traditional pad in the fabrication of optical silicon substrates.
Tian, Yebing +2 more
core +1 more source
Development of fixed abrasive chemical mechanical polishing process for glass disk substrates [PDF]
, 2013 Glass disk substrates are used in a wide range of portable devices because of their relatively high resistance to heat and shocks compared to aluminum substrates.
Zhong, Zhao Wei +3 more
core +1 more source