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Fixed Abrasive Polishing in an Anhydrous Environment: A Material Removal Model for Fused Silica
Due to the prevalent randomness and uncertainties associated with traditional loose polishing, fixed abrasive polishing in an anhydrous environment has been chosen as a new polishing method. In this paper, cerium oxide is the main component for polishing
Yuan Qian +3 more
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ELID Polishing of Glass Substrates Using a Grainless Iron-Bonded Wheel with Free Abrasive Particles [PDF]
Conventional polishing of glass substrates often results in surface scratches caused by passivated abrasive particles, leading to defects and reduced yield. To overcome this limitation, an iron-bonded wheel with free abrasive grains was proposed in ELID (
Huali Zhang +3 more
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Influences of Nonaqueous Slurry Components on Polishing 4H-SiC Substrate with a Fixed Abrasive Pad
4H-SiC wafers are more likely to sustain a lower material removal rate (MRR) and severe subsurface damage in conventional chemical mechanical polishing (CMP) methods.
Jiyuan Zhong +6 more
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Single-crystal sapphire specimen (α-Al2O3) have been widely applied in the semiconductor industry, microelectronics, and so on. In order to shorten the production time and improve the processing efficiency of sapphire processing, an integrated fixed ...
Linlin Cao +6 more
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Effect of pad and slurry on fixed abrasive polishing of gallium oxide crystal
Gallium oxide crystal is one of the most representative fourth generation semiconductor materials with the advantages of high band gap, high voltage resistance and short absorption cutoff edge. It has broad application prospects.
WU Cheng +4 more
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Effect of air abrasive polishing on nickel release, stainless steel corrosion, and nickel-titanium archwires [PDF]
Background. Orthodontic treatment is becoming more and more popular. However, using fixed orthodontic devices for treatment affects oral hygiene and raises the risk of corrosion, plaque-related illnesses, and dental discoloration-related issues.
Mohanad Ali Mohammed, Alan Issa Saleem
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High quality, highly efficient finishing processes are required for finishing difficult-to-machine materials. Magnetic abrasive finishing (MAF) process is a finishing method that can obtain a high accuracy surface using fine magnetic particles and ...
Yanhua Zou +3 more
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Ultrasonic technology is widely applied in the engineering ceramic polishing processes without the limitation of material properties and ideally integrated into computer numerical control system.
Xin Chen +6 more
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Chemical mechanical polishing (CMP) technology is one of the key technologies to realize the global planarization of semiconductor wafer surfaces. With the increasing popularity and universality of its application, more and higher requirements are put ...
Jianguo Yao +4 more
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Optimal design and experimental study of fixed abrasive pads based on coupling of damping regulation and pellet arrangement [PDF]
Lapping and polishing technology is an efficient processing method for wafer planarization processing. The structure of the fixed abrasive pad (FAP) is one of the most concerning issues in the research. The FAP structure affects the pressure distribution
C. Xu, C. Fang, Y. Li, C. Liu
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