Results 121 to 130 of about 87,277 (311)
The temperature dependence of fatigue behavior in nickel‐based superalloys is investigated through high‐resolution measurements of plastic localization. While increasing temperature reduces localization and enhances fatigue performance in René 88DT, Inconel 718 exhibits a sharp degradation at intermediate temperature due to intensified slip ...
M. Calvat +5 more
wiley +1 more source
Presented at Fourteenth International Congress on Electron Microscopy Cancun, Mexico, August 31-September 4, 1998, and published in Proceedings Over ten years after the discovery of high-TC superconductors, their widespread application into viable ...
Browning, N.D.; Buban, J.P.; Christen, D.K.; Nellist, P.D.; Norton, D.P.; Pennycook, S.J.; Prouteau, C.; Verebelyi, D.
core
EBIC MEASUREMENTS ON LOW ANGLE GRAIN BOUNDARIES
The largest grains in Polix ingots contain several low-angle grain boundaries. The electrical properties of high angle grain boundaries have extensively been studied by EBIC/TEM techniques (1) but comparatively less attention has been paid to those of ...
G. NOUET, A. BARY
core +1 more source
Fatigue Crack Initiation and Growth in Nanocrystalline Ni at Multiple Length‐Scales
Overview of miniaturized in situ SEM fatigue setup and resultant fatigue crack growth data for nanocrystalline Ni. The presented study focuses on the analysis of fatigue crack growth rate (FCGR) in focused ion beam‐notched microcantilevers prepared from nanocrystalline (NC) Ni as a model material.
Igor Moravcik +7 more
wiley +1 more source
Microstructural modelling of creep crack growth from a blunted crack [PDF]
The effect of crack tip blunting on the initial stages of creep crack growth is investigated by means of a planar microstructural model in which grains are represented discretely. The actual linking-up process of discrete microcracks with the macroscopic
Giessen, E. van der +4 more
core
Tailoring Functional Properties of Ti–Ni–Cu Shape Memory Alloy Thin Films for MEMS Actuators
A comprehensive study of critical parameters required to develop well‐performing Ti–Ni–Cu thin film shape memory alloy microactuators is provided. Materials science and device integration aspects are integrated by addressing structural and physical relationships using complementary characterization techniques as well as a practical fabrication solution
Elaheh Akbarnejad +6 more
wiley +1 more source
A diffusion-kinetic model was proposed to analyze the oxidation process in a nanostructured material with explicit identification of grain boundaries. It was assumed that oxygen migrates faster along the boundaries than it does in the grain volume.
M. V. Chepak-Gizbrekht, A. G. Knyazeva
doaj +1 more source
Creep‐Induced Microstructural Evolution in an A2‐B2 Superalloy
A 27.3Ta‐27.3Mo‐27.3Ti‐8Cr‐10Al (at.%) refractory high‐entropy alloy with precipitation‐strengthened A2‐B2 microstructure was studied by creep tests at 1030°C, which demonstrate a transition in deformation mechanisms in the range of 100–150 MPa applied stress. This is associated with changes in dislocation–precipitate interactions. Relevant deformation
Liu Yang +10 more
wiley +1 more source
GRAIN BOUNDARIES AND ANTIPHASE BOUNDARIES IN GaAs
Bicrystals of GaAs with a predetermined orientation relationships between the grains have been produced by growing GaAs epilayers on substrates cut from Czochralski-grown germanium bicrystals.
N.-H. CHO +3 more
core +1 more source
Influence of Test Temperature and Test Frequency on Fatigue Life of Aluminum Alloy EN AW‐2618A
The influence of test temperature and test frequency on the fatigue life of EN AW‐2618A is investigated. High‐cycle fatigue tests are performed at different test temperatures and frequencies on the 1000 h/230°C overaged state. Both test parameters reduce fatigue life due to time‐dependent damage mechanisms.
Ying Han +5 more
wiley +1 more source

