Results 1 to 10 of about 867,433 (306)
Reconciling grain growth and shear-coupled grain boundary migration [PDF]
Conventional grain growth models assume the velocity of a grain boundary is proportional to its curvature but cannot account for the many deviations observed experimentally.
Spencer L. Thomas +4 more
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Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing [PDF]
Highly (111)-oriented nanotwinned Cu (nt-Cu) films were fabricated on silicon wafers for thermal-stress characterization. We tailored the microstructural features (grain scale and orientation) of the films by tuning the electroplating parameters.
Jyun-Yu Lai +6 more
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Entropy decay during grain growth. [PDF]
AbstractMaterials with random microstructure are characterized by additional thermodynamic parameters, entropy and temperature of microstructure. It has been argued that there is one more law of thermodynamics: entropy of microstructure decays in isolated systems. In this paper, we check this assertion experimentally for the process of grain growth. We
Vedanti P, Wu X, Berdichevsky V.
europepmc +4 more sources
Numerical simulation of grain-size effects on creep crack growth by means of grain elements [PDF]
The effect of grain size on creep crack growth is investigated by means of a numerical technique in which the actual crack growth process is simulated in a discrete manner by grain elements and grain boundary elements.
Giessen, E. van der,, Onck, P.R.,
core +12 more sources
A general mechanism of grain growth-Ⅱ: Experimental
The formed microstructure inside polycrystalline materials strongly influences their practical performances, which process is mostly dominated by grain growth behaviors.
Jianfeng Hu +5 more
doaj +1 more source
A general mechanism of grain growth ─Ⅰ. Theory
The behaviors of grain growth dominate the formation of the microstructure inside polycrystalline materials and thus strongly influence their practical performances.
Jianfeng Hu +5 more
doaj +1 more source
Large degradation in thermal insulation and strain tolerance is a main headache and a primary cause of the failure for plasma-sprayed thermal barrier coatings (TBCs) during service.
Guang-Rong Li +4 more
doaj +1 more source
Low temperature sintered giant dielectric permittivity CaCu3Ti4O12 sol-gel synthesized nanoparticle capacitors [PDF]
This paper reports on synthesis of polycrystalline complex perovskite CaCu3Ti4O12 (as CCTO) ceramic powders prepared by a sol–gel auto combustion method at different sintering temperatures and sintering times, respectively.
Venkata Sreenivas Puli +4 more
doaj +1 more source
Simulation of CP-Ti Recrystallization and Grain Growth by a Cellular Automata Algorithm: Simulated Versus Experimental Results [PDF]
The application of cellular automata in materials science requires the conversion of the automata's rules and abstract general properties to rules and properties associated with the material and phenomena under study.
Rodrigo José Contieri +2 more
doaj +1 more source
Sm0.2Ce0.8O1.9 electrolytes were prepared using a novel chitosan templating method. To examine the sintering kinetics of the materials, 5 minutes, 1 hour, and 6 hours of sintering processes were carried out at 1200, 1300, and 1400 ⁰C. The phase structure
Dilara Güçtaş +2 more
doaj +1 more source

