Influence of Grinding Process Parameters on the Three-Dimensional Surface Roughness of Silicon Carbide Particle-Reinforced Aluminum Matrix (SiCp/Al) Composites. [PDF]
Li Z, Wang S, Zhao Y, Zhang L, Deng Z.
europepmc +1 more source
Discrete element method parameter calibration and validation of wheat based on the Tavares model. [PDF]
Jia H, Feng B, Wu W, Yang K.
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Chloride Ion Adsorption by Modified Pisha Sandstone-Based Cementitious Materials. [PDF]
Li C +7 more
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Magnetic Microspheres as Microrobot Bodies: Optimized Chitosan Modification and Gel Dispersion for Controlled Release of Doxorubicin. [PDF]
Ma S, Xu L.
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Computer Simulation of Tooth Wear in Giant Pandas (<i>Ailuropoda melanoleuca</i>): Quantitative Predictions for Captive Health Management. [PDF]
Chen F +16 more
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A predictive model of grinding force in silicon wafer self-rotating grinding
International Journal of Machine Tools and Manufacture, 2016Abstract Silicon wafer thinning is mostly performed by the method of self-rotating grinding. In grinding, the grinding force is a crucial factor of affecting the grinding performance, form accuracy and surface/subsurface thinning quality. To control the thinning quality of ground wafer, grinding force is the most essential factor need to be ...
Fei Qin, Tong An, Pei Chen
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A New Model for Grinding Force Prediction and Analysis
International Journal of Machine Tools and Manufacture, 2010In the present paper a new grinding force model is developed by incorporating the effects of variable coefficient of friction and ploughing force. This is based on the fact that chip formation during grinding consists of three stages: ploughing, cutting and rubbing.
P Venkateswara Rao, Vijayender Singh
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Forced Cooling Modeling in Grinding
2021A mathematical model is developed for a grinding temperature cycle, invariant to the machining material properties and grinding modes with the managed dimensionless parameters of forced cooling, taking into account the heat exchange and grinding fluid temperature.
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