Results 251 to 260 of about 17,833 (305)
A stereotactic laser interstitial thermal therapy strategy to flank dense calcifications within epileptogenic lesions: illustrative case. [PDF]
J Neurosurg Case LessonsDe La Peña NM +4 more
europepmc +1 more source
Numerical simulation of heat transfer and fluid characteristics in micro-channels with obliquely arranged capsule-shaped ribs and optimization study of structural parameters. [PDF]
PLoS OneYao J +8 more
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Recent Developments in Novel TPMS Lattice Materials: Design Optimization, Performance Control, and Applications in Biomimetic Scaffolds. [PDF]
Materials (Basel)Ahmad SZ +5 more
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SAE Technical Paper Series, 1999
<div class="section abstract"><div class="htmlview paragraph">A silicon micromachined heat sink is presented. The device uses liquid cooling in microchannels to remove high heat fluxes. Deep reactive ion etching and multiple wafer bonding is employed to fabricate high aspect ratio, enhanced heat transfer surfaces and a flow channel network ...
Christopher A. Bang +2 more
openaire +1 more source
<div class="section abstract"><div class="htmlview paragraph">A silicon micromachined heat sink is presented. The device uses liquid cooling in microchannels to remove high heat fluxes. Deep reactive ion etching and multiple wafer bonding is employed to fabricate high aspect ratio, enhanced heat transfer surfaces and a flow channel network ...
Christopher A. Bang +2 more
openaire +1 more source
Characterization of Heat Sink Flow Bypass in Plate Fin Heat Sinks
Heat Transfer, Volume 5, 2002Experimental testing has been performed on two plate fin heat sinks in order to examine flow bypass phenomenon. The present study examines pressure drop and thermal resistance as well as flow velocities within the heat sinks. Tests are performed for bypass channel/fin height ratios of 0.25, 0.5, 0.75 and 1 with approach velocities from 2 to 8 m/s.
W. Leonard +3 more
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A method to rank heat sinks in practice: the heat sink performance tester
Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005., 2005One way of cooling electronic devices is through enlarging the surface that is in contact with a fluid (usually air) by attaching a heat sink. Since literally thousands of heat sinks are available many designers are confronted with the question: which one? Very often the designer's choice is based on cost and manufacturer's data.
C.J.M. Lasance, H.J. Eggink
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International Symposium on Microelectronics, 2010
Conventional heat sinks for processors achieve improved heat transfer efficiency by impinging ambient air over stationary fins. Further improvement in the air film heat transfer coefficient through increased air speed becomes asymptotic and invariably results in undesirable acoustic noise.
Vijay Khanna +2 more
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Conventional heat sinks for processors achieve improved heat transfer efficiency by impinging ambient air over stationary fins. Further improvement in the air film heat transfer coefficient through increased air speed becomes asymptotic and invariably results in undesirable acoustic noise.
Vijay Khanna +2 more
openaire +1 more source