Results 261 to 270 of about 136,273 (298)

Heat Sinks in Computers

2014
Finned heat sinks are used in computers to promote heat transfer from the Integrated Circuit (IC) chips to cooling air. This chapter provides the background information and the tutorial materials about heat sinks. First, the mechanism of heat generation by electronic circuits is explained.
openaire   +1 more source

Heat Transfer in Spiral Channel Heat Sinks

ASME 2011 9th International Conference on Nanochannels, Microchannels, and Minichannels, Volume 1, 2011
Heat transfer in a spiral heat sink is examined experimentally and analytically. The spiral channel was fabricated on a base plate of copper. The cross section of the channel is square with 1 mm sides. A copper cap plate was bolted tight to seal the channel.
M. Ghobadi, Y. S. Muzychka
openaire   +1 more source

Partially heated heat sinks in a zero-bypass

International Communications in Heat and Mass Transfer, 2012
Abstract The need to improve the thermal performance of heat sinks remains a design priority for thermal engineers. Most of the considerations so far have involved various shapes and sizes of the fin designs. This numerical study evaluates the influence of the heating position on the thermal performance of a plate-fin heat sink in a zero-bypass ...
N.G. Emekwuru, F.R. Hall, P.J. Spence
openaire   +1 more source

Heat transfer characteristics of a centrifugal heat sink

International Journal of Heat and Mass Transfer, 2013
Abstract A novel heat sink, called a centrifugal heat sink, into which the blades of a fan are integrated between the fins, is proposed. The fan blades, based on design principles of centrifugal turbomachinery, are arranged to be placed between the fins of the circular heat sink. The rotary motion of the blades causes nearby coolant to be sucked into
Kim, JW Kim, Ju-Wan, Kim, SJ Kim, Sung-Jin   +1 more
openaire   +2 more sources

Measurements of heat transfer in microchannel heat sinks

International Communications in Heat and Mass Transfer, 2000
Abstract The paper presents new experimental measurements for pressure drop and heat transfer coefficient in microchannel heat sinks. Tests were performed with devices fabricated using standard Silicon 100 wafers. Two different channel patterns were studied.
openaire   +1 more source

The Digital Heat Sink

CKS FRAMEWORK PAPER - Registry ID: CKS-0-2026. Dependencies: CKS foundation only. This is a constituent derivation of the Cymatic K-Space Mechanics (CKS) framework extending into 0. The paper is subject to the Global Falsification Protocol [CKS-TEST-1-2026]: if the 1/32 Hz substrate quantization is absent in relevant precision measurements, this ...
openaire   +1 more source

Thermal management and temperature uniformity enhancement of electronic devices by micro heat sinks: A review

Energy, 2021
Ziqiang He, Yunfei Yan, Zhien Zhang
exaly  

Fluid flow and heat transfer characteristics of microchannel heat sinks with different groove shapes

International Journal of Thermal Sciences, 2021
Qifeng Zhu
exaly  

Heat sink design: heat sink design for a company.

Throughout the project, I utilized SolidWorks Software to design, assemble, and simulate a heat sink for a heat sink company with a computer science background that needs it to be used on a silicon computer chip. The primary objective was to design a heat sink that could lower the temperature of the silicon chip to less than 43.5ºC.
openaire   +1 more source

Effects of pin fin height, spacing and orientation to natural convection heat transfer for inline pin fin and plate heat sinks by experimental investigation

International Journal of Heat and Mass Transfer, 2021
Eyüb Canli
exaly