Results 201 to 210 of about 1,582,431 (312)

Effect of Acrylic Structural Adhesive as a Joint Reinforcement on Film Deformation during the Thermoforming Process for In‐Mold Electronic Devices

open access: yesAdvanced Engineering Materials, EarlyView.
In‐mold electronics (IME) enables the integration of circuits into more complex scenarios, yet the key challenge remains ensuring a fully functional device. This study investigates how the presence of structural adhesives can improve the performance and functionality of IME devices, addressing key challenges in device integration.
Francisco Ituriel Arias‐García   +3 more
wiley   +1 more source

High‐Rate Deposition and Characterization Study of CoZrO Films for On‐Chip Power Applications

open access: yesAdvanced Engineering Materials, EarlyView.
This study introduces a high‐rate reactive sputtering process for CoZrO films, aimed at large‐scale production of on‐chip magnetic components compatible with complementary metal oxide semiconductor (CMOS) fabrication. Characterization of the deposited films reveals that ideal magnetic properties require chemical compositions in a narrow Co:O range and ...
Elaine Ng   +6 more
wiley   +1 more source

High levels of heat stress among sugarcane workers in Thailand. [PDF]

open access: yesAnn Work Expo Health
Tantipanjaporn T   +3 more
europepmc   +1 more source

Influence of a Hydrogen Addition to the Inert Gas and Subsequent Heat Treatments on the Microstructure and Mechanical Properties of Magnesium WE43 Fabricated by PBF‐LB/M

open access: yesAdvanced Engineering Materials, EarlyView.
This article investigates optimal processing conditions for the laser‐based powder bed fusion of WE43. To limit the interaction with remaining oxygen, a 3 vol% hydrogen admixture to the inert gas is investigated. Furthermore, heat treatments are investigated in the range of 250–350 °C for 48 h.
Arvid Abel   +9 more
wiley   +1 more source

An Examination of Aerosol Jet‐Printed Surface Roughness and its Impact on the Performance of High‐Frequency Electronics

open access: yesAdvanced Engineering Materials, EarlyView.
This study explores aerosol jet‐printed (AJP) surface roughness, its effects on the performance of microwave electronics, and its process contributors. First, an electromagnetic model is vetted for AJP's unique roughness signature. Simulations are built which show process‐induced roughness is as significant as conductor resistivity in driving microwave
Christopher Areias, Alkim Akyurtlu
wiley   +1 more source

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