Results 201 to 210 of about 1,582,431 (312)
In‐mold electronics (IME) enables the integration of circuits into more complex scenarios, yet the key challenge remains ensuring a fully functional device. This study investigates how the presence of structural adhesives can improve the performance and functionality of IME devices, addressing key challenges in device integration.
Francisco Ituriel Arias‐García+3 more
wiley +1 more source
A Study on the Effects of Cyclic Thermal Stresses on Heat Resisting Metals
Tsukumo UNO, Hidekazu Yamanouchi
openalex +2 more sources
High‐Rate Deposition and Characterization Study of CoZrO Films for On‐Chip Power Applications
This study introduces a high‐rate reactive sputtering process for CoZrO films, aimed at large‐scale production of on‐chip magnetic components compatible with complementary metal oxide semiconductor (CMOS) fabrication. Characterization of the deposited films reveals that ideal magnetic properties require chemical compositions in a narrow Co:O range and ...
Elaine Ng+6 more
wiley +1 more source
High levels of heat stress among sugarcane workers in Thailand. [PDF]
Tantipanjaporn T+3 more
europepmc +1 more source
TEMPERATURE DISTRIBUTION AND THERMAL STRESSES IN A SLAB WITH EXPONENTAL HEAT SOURCE
H.F. Menzel
openalex +2 more sources
This article investigates optimal processing conditions for the laser‐based powder bed fusion of WE43. To limit the interaction with remaining oxygen, a 3 vol% hydrogen admixture to the inert gas is investigated. Furthermore, heat treatments are investigated in the range of 250–350 °C for 48 h.
Arvid Abel+9 more
wiley +1 more source
Molecular aspects of heat stress sensing in land plants. [PDF]
Calixto CPG.
europepmc +1 more source
Stress-Corrosion Cracking of Heat-Treated Austenitic Stainless Steels
Shigeru Morita
openalex +2 more sources
Catalase activity during the recovery of heat-stressed Staphylococcus aureus MF-31 [PDF]
Gerard P. Andrews, Scott E. Martin
openalex +1 more source
This study explores aerosol jet‐printed (AJP) surface roughness, its effects on the performance of microwave electronics, and its process contributors. First, an electromagnetic model is vetted for AJP's unique roughness signature. Simulations are built which show process‐induced roughness is as significant as conductor resistivity in driving microwave
Christopher Areias, Alkim Akyurtlu
wiley +1 more source