Results 231 to 240 of about 231,021 (266)

Integration of heterogeneous networking testbeds

Proceedings of the 4th International ICST Conference on Testbeds and Research Infrastructures for the Development of Networks and Communities, 2008
Mahindra R., Bhanage G., Hadjichristofi G., Ganu S., Kamat P., Seskar I., Raychaudhuri D.   +6 more
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Materials for heterogeneous integration

MRS Bulletin, 2021
Madhavan Swaminathan, Mohan Kathaperumal, Kyoung-sik Moon, Himani Sharma, Prahalad Murali, Siddharth Ravichandran   +5 more
openaire   +1 more source

Chip Partition Heterogeneous Integration and Chip Split Heterogeneous Integration

2023
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Trends in Heterogeneous Integrations

2019
Semiconductor industry has identified five main growth engines (applications), namely (1) mobile, (2) high-performance computing (HPC), (3) automotive (especially self-driving car), (4) internet of things (IoTs), and (5) big data (especially for cloud computing).
openaire   +1 more source

Overview of Heterogeneous Integrations

2019
Multichip module (MCM), system-in-package (SiP), and heterogeneous integration use packaging technology to integrate dissimilar chips, optical devices, and/or packaged chips with different materials and functions, from different fabless houses, foundries, wafer sizes, and feature sizes into a system or subsystem on different substrates or stand alone ...
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The Progress and Trend of Heterogeneous Integration Silicon/III-V Semiconductor Optical Amplifiers

Photonics, 2023
Wenqi Shi
exaly  

Substrates for Heterogeneous Integration

IMAPSource Proceedings
Driven by 5G and AI, the semiconductors’ speed increases, density increases, pad-pitch decreases, chip-size increases, and power dissipation increases. All these provide challenges (opportunities) to advanced packaging technology such as the heterogeneous integration (HI), which uses various packaging technologies to integrate dissimilar chips ...
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Chiplet Heterogeneous Integration Technology—Status and Challenges

Electronics (Switzerland), 2020
Rulin Liu, Sun Zhigang
exaly  

Digital Electrochemistry for On‐Chip Heterogeneous Material Integration

Advanced Materials, 2021
Oliver G Schmidt, Christian Becker, Stefan Baunack   +2 more
exaly  

Heterogeneous and 3D Integration at DARPA

2019 International 3D Systems Integration Conference (3DIC), 2019
Timothy M. Hancock, Jeffrey C. Demmin
openaire   +1 more source