Results 281 to 290 of about 260,326 (318)
Some of the next articles are maybe not open access.
Challenges and recent prospectives of 3D heterogeneous integration
E-Prime, 2022Shuye Zhang, Hongzhi Zhou
exaly
Integration of heterogeneous networking testbeds
Proceedings of the 4th International ICST Conference on Testbeds and Research Infrastructures for the Development of Networks and Communities, 2008Mahindra R. +6 more
openaire +1 more source
Recent Advances and Trends in Multiple System and Heterogeneous Integration With TSV Interposers
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023John H Lau
exaly
Materials for heterogeneous integration
MRS Bulletin, 2021Madhavan Swaminathan +5 more
openaire +1 more source
Overview of Heterogeneous Integrations
2019Multichip module (MCM), system-in-package (SiP), and heterogeneous integration use packaging technology to integrate dissimilar chips, optical devices, and/or packaged chips with different materials and functions, from different fabless houses, foundries, wafer sizes, and feature sizes into a system or subsystem on different substrates or stand alone ...
openaire +1 more source
Substrates for Heterogeneous Integration
IMAPSource ProceedingsDriven by 5G and AI, the semiconductors’ speed increases, density increases, pad-pitch decreases, chip-size increases, and power dissipation increases. All these provide challenges (opportunities) to advanced packaging technology such as the heterogeneous integration (HI), which uses various packaging technologies to integrate dissimilar chips ...
openaire +1 more source
Deep knowledge integration of heterogeneous features for domain adaptive SAR target recognition
Pattern Recognition, 2022Yukun Zhang, Xiansheng Guo, Lin Li
exaly
Digital Electrochemistry for On‐Chip Heterogeneous Material Integration
Advanced Materials, 2021Bin Bao, Boris Rivkin, Farzin Akbar
exaly
Chip Partition Heterogeneous Integration and Chip Split Heterogeneous Integration
2023openaire +1 more source