Results 131 to 140 of about 185,261 (290)
Wafer‐Scale 3D Integration for High‐Density Multi‐Valued Neuromorphic Logic
Wafer‐scale 3D vertically integrated multi‐valued logic (MVL) circuits are realized by monolithically integrating a Te/IGZO heterojunction FET with an engineered Te pull‐up FET. Heterointerface‐mediated transport and optimized current matching enable stable ternary operation, while vertical stacking reduces circuit footprint and interconnect complexity,
Chang‐Hyeon Kim +5 more
wiley +1 more source
This review presents the research advances of adaptive conductive systems from the perspective of materials, circuits, systems, and applications. Deformable conductors consist of substrates/matrices and conductive materials, structural design of circuit interconnections, fabrication of circuit interconnections, as well as intelligent systems ...
Yufei Lu +7 more
wiley +1 more source
In this paper, a novel enhancement-mode β-Ga2O3-based FinFET structure with a gate formed by the NiO/β-Ga2O3 heterojunction named HJ-FinFET has been proposed, and the excellent performance of the device has also been demonstrated. The primary operational
Jiangang Yu +6 more
doaj +1 more source
Voltage-controlled NiO/ZnO p-n heterojunction diode: a new approach towards selective VOC sensing. [PDF]
Dey S, Nag S, Santra S, Ray SK, Guha PK.
europepmc +1 more source
A novel bias‐programmable shortwave infrared (SWIR) vision sensor is developed using multi‐junction colloidal quantum dots (QDs). Under varying applied voltage, the back‐to‐back rectifying junctions effectively tune trapping centers to switch the device between high‐speed photodetector and persistent synapse modes.
Zhuoyang He +6 more
wiley +1 more source
Energy‐harvesting‐integrated sensors couple ambient energy conversion with sensing, processing, and wireless communication. This review organizes recent progress through integration architectures and operating principles, revisiting co‐packaged, monolithic, and co‐functional designs together with always‐on, event‐driven, and multi‐modal sensing modes ...
Taehyun Park +5 more
wiley +1 more source
Gel-Based PVA/SiO2/p-Si Heterojunction for Electronic Device Applications
The current work presents a new structure based on Au/PVA/SiO2/p-Si/Al that has not been studied before. An aqueous solution of polyvinyl alcohol (PVA) polymer gel was deposited on the surface of SiO2/Si using the spin-coating technique.
Adel Ashery +3 more
doaj +1 more source
Recent advances in metasurface‐enabled low‐observable technologies are reviewed from the perspective of cross‐scale material–structure synergy. Electromagnetic, thermal, optical, and acoustic stealth are highlighted together with dynamic tuning, programmable coding, data‐driven inverse design, artificial intelligence, multispectral compatibility, and ...
Shuhao Wang +5 more
wiley +1 more source
In this study, ultrathin CuInxGa1-xSe2 (CIGS) films with two distinct thicknesses were grown on n-Si substrates by pulsed laser deposition (PLD), with thickness controlled by varying the number of laser pulses.
Gezgin Serap Yiğit +3 more
doaj +1 more source
A dual‐randomness hardware platform is demonstrated by integrating PUF and TRNG functionalities into mixed‐ZGO nanoclusters. By leveraging spatial and temporal stochasticity, the mixed‐ZGO NCs device enables both unique identification and random signal generation.
Seungme Kang +6 more
wiley +1 more source

