Results 201 to 208 of about 657,295 (208)

Study on Effect of Junction Temperature Swing Duration on Lifetime of Transfer Molded Power IGBT Modules

IEEE Transactions on Power Electronics, 2017
Frede Blaabjerg, Ui-Min Choi, Søren Jørgensen   +2 more
exaly  

Dynamic Characterization of Parallel-Connected High-Power IGBT Modules

IEEE Transactions on Industry Applications, 2015
Filippo Chimento
exaly  

Fast Power Cycling Protocols Implemented in an Automated Test Bench Dedicated to IGBT Module Ageing

Microelectronics Reliability, 2015
Francois FOREST, Thierry Martire, Jean-Jacques Huselstein   +2 more
exaly  

Thermal Parameter Monitoring of IGBT Module Using Case Temperature

IEEE Transactions on Power Electronics, 2019
Heng-Ming Tai, Xiong Du, Quanming Luo
exaly  

Thermal Characterization System for Transient Thermal Impedance Measurement and Power Cycling of IGBT Modules

Microelectronics Reliability, 2015
Khai Ngo, Guo-Quan Lu, Hanguang Zheng
exaly  

Condition Monitoring the Inhomogeneous Thermal Fatigue of Multichip IGBT Module Based on the Thermal Attenuation Coefficient

IEEE Transactions on Power Electronics
Xiong Du
exaly  

A Critical Evaluation of Modern IGBT-Modules

1995
Blaabjerg, Frede; id_orcid 0000-0001-8311-7412, Pedersen, John Kim, Jæger, Ulrik   +2 more
openaire   +1 more source

ULTRASONIC NDE OF IGBT METAL MATRIX BASEPLATE MODULES

2003
TETI, ROBERTO, L. FRATELLI
openaire   +2 more sources