Results 61 to 70 of about 102,601 (297)

Diffusion bonding, brazing and resistance welding of zirconium alloys: a review

open access: yesJournal of Materials Research and Technology, 2023
The joining of zirconium alloys is an important issue in the field of nuclear energy since zirconium alloys are often used as nuclear fuel cladding tube.
Ziyu Zhang   +11 more
doaj   +1 more source

Particles with selective wetting affect spinodal decomposition microstructures

open access: yes, 2017
We have used mesoscale simulations to study the effect of immobile particles on microstructure formation during spinodal decomposition in ternary mixtures such as polymer blends.
Abinandanan, T. A.   +3 more
core   +1 more source

A Thermodynamic 3D Model for the Simulation of Diffusion‐Controlled Alloying Processes in Heterogeneous Material Structures

open access: yesAdvanced Engineering Materials, EarlyView.
A numerical model resulting from irreversible thermodynamics for describing transport processes is introduced, focusing on thermodynamic activity gradients as the actual driving force for diffusion. Implemented in CUDA C++ and using CalPhaD methods for determining the necessary activity data, the model accurately simulates interdiffusion in aluminum ...
Ulrich Holländer   +3 more
wiley   +1 more source

Interfacial microstructure and mechanical property of Ti60/Ti2AlNb alloy joints brazed with TiZrNiCu amorphous filler metal

open access: yesHanjie xuebao
The Ti60 alloy was successfully vacuum-brazed with Ti2AlNb alloy by using TiZrNiCu amorphous filler metal. SEM, EDS, and other methods were used to analyze the interfacial microstructure of the brazed joint.
Jingxin XU   +6 more
doaj   +1 more source

Influence of Sample Preparation and Processing Procedures on the Thermal Diffusivity of MgO‐C Refractories

open access: yesAdvanced Engineering Materials, EarlyView.
The thermal diffusivity of MgO‐C refractories is highly sensitive to sample preparation and processing procedures. In this article, the effects of coking sequence, machining conditions, structural inhomogeneity, and graphite coating application on measurements using laser flash apparatus are systematically investigated.
Luyao Pan   +4 more
wiley   +1 more source

The welding kinetics of interface evolution and mechanism in IN718 alloy solid-state welding

open access: yesJournal of Materials Research and Technology
The welding kinetics of interface evolution and mechanism inIN718 alloy solid-state welding are investigated systematically by comparing the hot compression behavior of the separated samples and conventional samples in the temperature range of 1000 °C ...
Lei Zhou   +7 more
doaj   +1 more source

Generation and characterization of T40/A5754 interfaces with lasersPatrice [PDF]

open access: yes, 2014
Laser-induced reactive wetting and brazing of T40 titanium with A5754 aluminum alloy with 1.5 mm thickness was carried out in lap-joint configuration, with or without the use of Al5Si filler wire. A 2.4 mm diameter laser spot was positioned on the aluminum
BERTHE, Laurent   +5 more
core   +10 more sources

Microstructural Evolution and Vacancy Defect Formation in Mn–Mo–Ni RPV Steel Under Low Cycle Fatigue: Insights From EBSD and PALS

open access: yesAdvanced Engineering Materials, EarlyView.
Low‐cycle fatigue damage in Mn–Mo–Ni reactor pressure vessel steel is examined using a combined electron backscatter diffraction and positron annihilation lifetime spectroscopy approach. The study correlates texture evolution, dislocation substructure development, and vacancy‐type defect formation across uniform, necked, and fracture regions, providing
Apu Sarkar   +2 more
wiley   +1 more source

Improvement on the mechanical properties of eutectic Sn58Bi alloy with porous Cu addition during isothermal aging

open access: yesMaterials Research Express, 2021
A comparison of the microstructure, interfacial IMC layer, shear behavior and hardness of the Sn58Bi, SnBi@110P-Cu/Cu and SnBi@500P-Cu/Cu solder joints was carried out during isothermal aging in this study.
Yang Liu   +5 more
doaj   +1 more source

Characterization Of Thermal Stresses And Plasticity In Through-Silicon Via Structures For Three-Dimensional Integration [PDF]

open access: yes, 2014
Through-silicon via (TSV) is a critical element connecting stacked dies in three-dimensional (3D) integration. The mismatch of thermal expansion coefficients between the Cu via and Si can generate significant stresses in the TSV structure to cause ...
Ho, P. S.   +4 more
core   +1 more source

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