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Optimization of Laminated Busbar for Three-Level NPC Topology Using SiC Module
2020 IEEE 9th International Power Electronics and Motion Control Conference (IPEMC2020-ECCE Asia), 2020In high power applications, laminated busbar has been used as main connection to reduce the loop stray inductance. Nowadays, the introduction of SiC device brings more strict requirements on busbar design because of its higher switching speed. This paper presents an optimization of busbar for three-level NPC topology using 62mm package SiC module by ...
Hongkeng Zhu, Laili Wang, Xu Yang
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A Laminated Busbar Design for Multiple IGBT Modules Paralleling
Lecture Notes in Electrical Engineering, 2023Feng Mu
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2020 IEEE International Conference on High Voltage Engineering and Application (ICHVE), 2020
The effect of DC electrothermal aging on breakdown strength $(\pmb{E}_{\mathbf{b}})$ of polyethylene terephthalate (PET) used in laminated busbar is studied. It is found that a maximum $\pmb{E}_{\mathbf{b}}$ of 837 kV/mm was found for 96 hours' aged sample. The dependence of activation energy of dc conductivity on aging time is investigated.
Jianying Li, Shihang Wang, Men Guo
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The effect of DC electrothermal aging on breakdown strength $(\pmb{E}_{\mathbf{b}})$ of polyethylene terephthalate (PET) used in laminated busbar is studied. It is found that a maximum $\pmb{E}_{\mathbf{b}}$ of 837 kV/mm was found for 96 hours' aged sample. The dependence of activation energy of dc conductivity on aging time is investigated.
Jianying Li, Shihang Wang, Men Guo
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2015 IEEE Applied Power Electronics Conference and Exposition (APEC), 2015
Multilevel technology and power semiconductor devices in series connection can both effectively improve the converter system power capacity. But both of them will enlarge the system size and lead to complex busbar structure which may cause large stray parameters, especially the stray inductances.
Shiqi Ji +2 more
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Multilevel technology and power semiconductor devices in series connection can both effectively improve the converter system power capacity. But both of them will enlarge the system size and lead to complex busbar structure which may cause large stray parameters, especially the stray inductances.
Shiqi Ji +2 more
exaly +2 more sources
2021 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia), 2021
Shaolin Yu, Xing Zhang
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Shaolin Yu, Xing Zhang
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Analysis of Mutual Inductance Between Parallel Branches for ANPC Laminated Busbar
2023 IEEE 14th International Symposium on Power Electronics for Distributed Generation Systems (PEDG), 2023Xiangning He +2 more
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2022 International Power Electronics Conference (IPEC-Himeji 2022- ECCE Asia), 2022
Keiji Wada
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Keiji Wada
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Multiphysics topology optimization for laminated busbars
2016 IEEE Conference on Electromagnetic Field Computation (CEFC), 2016Laminated busbars acquire significant importance even if they are a passive component in converters. Their flat and overlapped conducting layers allow good heat dissipation and reduced stray inductance. Topology optimization enables balancing the amount of copper used with the maximum temperature and stray inductance of the busbar.
Oriol Puigdellivol +4 more
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On the Likelihood of Partial Discharge Inception in Laminated Busbars from Electrified Ships
2021 IEEE Electric Ship Technologies Symposium (ESTS), 2021The likelihood of PD inception in Laminated Bus Bars (LBB) in the presence of defects embedded in the insulating material is investigated in this paper. The rationale behind is to understand if there is any potentiality of PD inception in defects internal to resin, considering the design electric fields, but also potential defects that can be present ...
Montanari G. C. +4 more
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