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Thermal Analysis of the Laminated Busbar System of a Multilevel Converter
IEEE Transactions on Power Electronics, 2016Laminated busbar systems are commonly used in power electronic converters because of their low stray inductance. While the electromagnetic analysis of a busbar system is widely presented in the literature, there is a lack of accurate thermal modeling. In this paper, the thermal analysis of the busbar system is presented.
Juha Pyrhönen +2 more
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Feasibility Analysis of Different Conducting and Insulation Materials Used in Laminated Busbars
Materials Today: Proceedings, 2020Abstract This paper discusses the DC power distribution topology by means of laminated busbar for medium power applications such as energy storage systems in electric vehicles. The optimized power distribution for laminated busbar is compared for materials such as copper, aluminum and Gold.
Satyanarayana Kosaraju +1 more
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IEEE Transactions on Circuits and Systems I: Regular Papers, 2021
Silicon Carbide (SiC) MOSFETs are usually paralleled to increase the current capability for high power applications. While, the asymmetrical parasitic parameters of the wide-used laminated busbar can cause current imbalance for paralleled MOSFETs. The fast switching of SiC devices can further deteriorate the imbalance.
Jianing Wang, Shaolin Yu, Xing Zhang
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Silicon Carbide (SiC) MOSFETs are usually paralleled to increase the current capability for high power applications. While, the asymmetrical parasitic parameters of the wide-used laminated busbar can cause current imbalance for paralleled MOSFETs. The fast switching of SiC devices can further deteriorate the imbalance.
Jianing Wang, Shaolin Yu, Xing Zhang
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On the Likelihood of Partial Discharge Inception in Laminated Busbars from Electrified Ships
2021 IEEE Electric Ship Technologies Symposium (ESTS), 2021The likelihood of PD inception in Laminated Bus Bars (LBB) in the presence of defects embedded in the insulating material is investigated in this paper. The rationale behind is to understand if there is any potentiality of PD inception in defects internal to resin, considering the design electric fields, but also potential defects that can be present ...
Montanari G. C. +4 more
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Multiphysics topology optimization for laminated busbars
2016 IEEE Conference on Electromagnetic Field Computation (CEFC), 2016Laminated busbars acquire significant importance even if they are a passive component in converters. Their flat and overlapped conducting layers allow good heat dissipation and reduced stray inductance. Topology optimization enables balancing the amount of copper used with the maximum temperature and stray inductance of the busbar.
Oriol Puigdellivol +4 more
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Design and optimization of laminated busbar to reduce transient voltage spike
2012 IEEE International Symposium on Industrial Electronics, 2012The presence of loop inductance causes significant surge voltage due to hard-switching operation of voltage source inverters. This generally requires high-voltage rating of switching devices, which results in additional cost and power loss. This paper presents a surge voltage model to study busbar stray inductances in Electric Vehicle systems.
Xuhui Wen, Weidong Xiao 0001
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Design of Laminated Busbar for SiC MOSFETs Dynamic Test Platform
2020 17th China International Forum on Solid State Lighting & 2020 International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS), 2020In order to test the dynamic characteristics of SiC MOSFETs more accurately, it is necessary to redesign the dynamic test platform for SiC MOSFETs. The parasitic inductance of the power circuit of the dynamic test platform is analyzed, and different stacked bus structures are designed according to the test requirements of different devices.
Wang Yi-fan +5 more
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Analysis of Mutual Inductance Between Parallel Branches for ANPC Laminated Busbar
2023 IEEE 14th International Symposium on Power Electronics for Distributed Generation Systems (PEDG), 2023Xiangning He, Sideng Hu, Mustafa Tahir
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Optimization of Laminated Busbar for Three-Level NPC Topology Using SiC Module
2020 IEEE 9th International Power Electronics and Motion Control Conference (IPEMC2020-ECCE Asia), 2020In high power applications, laminated busbar has been used as main connection to reduce the loop stray inductance. Nowadays, the introduction of SiC device brings more strict requirements on busbar design because of its higher switching speed. This paper presents an optimization of busbar for three-level NPC topology using 62mm package SiC module by ...
Hongkeng Zhu, Laili Wang, Xu Yang
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