Results 131 to 140 of about 13,635,921 (329)

Multiscale Modeling of Process‐Induced Defects in Fused Filament Fabrication‐Printed Materials

open access: yesAdvanced Engineering Materials, EarlyView.
This study presents a predictive multiscale modeling tool for defect analysis of fused filament fabricated‐printed materials and their performance prediction using a mechanistic data science‐based reduced‐order modeling approach. Process‐induced defects are inherent to additively manufactured parts and significantly influence the performance of printed
Satyajit Mojumder   +3 more
wiley   +1 more source

X‐Ray Computed Tomography Quantifies Primary Phases and Reveals Crack Morphology in High‐Cycle Fatigue of Aluminum Alloy EN AW‐2618A

open access: yesAdvanced Engineering Materials, EarlyView.
Primary phases and a fatigue crack are studied in a forged blank of an aluminum alloy using synchrotron and laboratory X‐ray computed tomography. To image the crack, the fatigue test is interrupted, and a static tensile load is applied to open the crack.
Jakob Schröder   +6 more
wiley   +1 more source

First‐Principles Modeling of Solid Solution Softening and Hardening Effects in Al–Mg–Zr–Si Aluminum Alloys

open access: yesAdvanced Engineering Materials, EarlyView.
The role of various alloying elements in face‐centered cubic aluminum on the barrier of a Shockley partial dislocation during its motion is presented. The study aims to understand how alloying atoms such as Mg, Si, and Zr affect the energy landscape for dislocation motion, thus influencing the solid solution hardening and softening in aluminum, which ...
Inna Plyushchay   +3 more
wiley   +1 more source

Multimaterial Approach to Improve the Mechanical Properties of a Novel Modified Auxetic Reentrant Honeycomb Structure

open access: yesAdvanced Engineering Materials, EarlyView.
A multimaterial approach is introduced to improve upon auxetic structures by combining two different polymers into the same reentrant honeycomb structure via additive manufacturing. The deformation behavior as well as the resulting Poisson's ratio are thereby improved significantly.
Alexander Engel   +2 more
wiley   +1 more source

Wafer Bonding Technologies for Microelectromechanical Systems and 3D ICs: Advances, Challenges, and Trends

open access: yesAdvanced Engineering Materials, EarlyView.
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan   +5 more
wiley   +1 more source

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