Results 221 to 230 of about 3,638,335 (270)
Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya +3 more
wiley +1 more source
The article overviews past and current efforts on caloric materials and systems, highlighting the contributions of Ames National Laboratory to the field. Solid‐state caloric heat pumping is an innovative method that can be implemented in a wide range of cooling and heating applications.
Agata Czernuszewicz +5 more
wiley +1 more source
Outcomes from institutional audit: learning support resources, including virtual learning environments [PDF]
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Two‐Way Shape Memory Polymer Composite Gripper for Adaptive Robotic Applications
A two‐way shape memory polymer (SMP) composite is developed with intrinsic shape‐changing capability driven solely by temperature, eliminating external actuation loads. Embedding the SMP in a low‐stiffness elastomeric matrix enabled reversible transformations during heating and cooling cycles.
Aamna Hameed, Kamran Ahmed Khan
wiley +1 more source
Advanced Techniques for Scalable Woven E‐Textiles Manufacturing
This review highlights recent advances in scalable weaving techniques for e‐textiles, emphasizing innovations in multilayer structures, conductive yarn integration, and loom modifications. It summarizes emerging materials, fabrication strategies, and performance considerations that enable reliable, durable, and industrially scalable woven electronic ...
Faisal Abedin +2 more
wiley +1 more source
Strategies for Enhancing Thermal Conductivity of PDMS in Electronic Applications
This review explores effective strategies for enhancing heat dissipation in Polydimethylsiloxane (PDMS)‐based composites, focusing on particle optimization, 3D network design, and multifunctional integration. It offers key insights into cutting‐edge methods and simulations that are advancing thermal management in modern electronic devices.
Xiang Yan, Marisol Martin‐Gonzalez
wiley +1 more source
Advanced Design for Weakly Coupled Resonators by Automatic Active Optimization
An Automatic Active Optimization (AAO) strategy integrates machine learning predictors and genetic algorithms in a closed‐loop workflow. By iteratively expanding its dataset with new discoveries, AAO overcomes the limits of conventional methods. This approach finds superior microstructural designs beyond the initial sample space. We demonstrate this on
Wei Yue +8 more
wiley +1 more source
Printed 2.5D‐Microstructures with Material‐Specific Functionalization for Tunable Biosensing
The 2.5D‐MiSENSE platform integrates a microstructured biosensor with an in‐line milking pipeline to enable real‐time detection of mastitis biomarkers during active milk flow. The system uses a 2.5D microengineered surface and patterned electrodes to enhance milk–sensor interaction.
Matin Ataei Kachouei +2 more
wiley +1 more source
This review explores advances in wearable and lab‐on‐chip technologies for breast cancer detection. Covering tactile, thermal, ultrasound, microwave, electrical impedance tomography, electrochemical, microelectromechanical, and optical systems, it highlights innovations in flexible electronics, nanomaterials, and machine learning.
Neshika Wijewardhane +4 more
wiley +1 more source
This study explores how machine learning models, trained on small experimental datasets obtained via Phase Doppler Anemometry (PDA), can accurately predict droplet size (D32) in ultrasonic spray coating (USSC). By capturing the influence of ink complexity (solvent, polymer, nanoparticles), power, and flow rate, the model enables precise droplet control
Pieter Verding +5 more
wiley +1 more source

