Results 261 to 270 of about 510,222 (299)
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Machineability in NURBS interpolator considering constant material removal rate
International Journal of Machine Tools and Manufacture, 2005Increasing demands on precision machining of three-dimensional free-form surfaces have necessitated that the tool move smoothly and at varying feedrates. To achieve this, parametric interpolators, such as the Non-Uniform Rational B-Spline (NURBS) interpolator, have been introduced in CNC machining systems.
Tae Jo Ko, Hee Sool Kim, Sung Ho Park
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Specific Material Removal Rate Calculation in Five-Axis Grinding
Journal of Manufacturing Science and Engineering, 2017Specific material removal rate (MRR) q′ was calculated for five-axis grinding in a virtual machining simulation environment (VMSE). The axis-symmetric tool rotational profile was arc-length parameterized. The twisted grazing curve due to the concurrent translation and rotation in every move was modeled through an exact velocity field and areal MRR ...
Raja Kountanya, Changsheng Guo
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Precision Measurements Of Material-Removal Rates In Superpolishing Sapphire
SPIE Proceedings, 1989As we demonstrate, sapphire can be polished by means of colloidal SiO2 (7 nmφ) in water by direct contact to a tin lap to a residual roughness better than 0.3 nm Rz measured with a Talystep profilometer. We use the superpolishing mechanism itself for producing microscopically smooth grooves which can serve for a precision measurement of the very small ...
B. Hader, O. Weis
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SPIE Proceedings, 2015
Fiber arrays are used to connect arrayed waveguide chips. The end-faces of fiber array components are multi-materials non-uniform surfaces. Their low polishing quality has become a bottleneck that restricts coupling performance of integrated photo-electronic devices.
Defu Liu, Guanglin Chen, Qing Hu
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Fiber arrays are used to connect arrayed waveguide chips. The end-faces of fiber array components are multi-materials non-uniform surfaces. Their low polishing quality has become a bottleneck that restricts coupling performance of integrated photo-electronic devices.
Defu Liu, Guanglin Chen, Qing Hu
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Interfacial plasticity controls material removal rate during adhesive sliding contact
Physical Review Materials, 2020Adhesive wear is a result of material exchange due to localized adhesive bonding between surface asperities at small scales. It has been recently debated whether a linear wear relation can be observed at the single-asperity level. Using large-scale atomistic simulations, we show that the wear relation is a direct result of the material removal ...
Kai Zhao, Ramin Aghababaei
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Modeling Material Removal Rates for Copper CMP Using Copper Nanohardness and Etch Rates
Journal of The Electrochemical Society, 2008Measurements of copper nanohardness and etch rate were used with alumina agglomerate size distributions in a model to predict material removal rates (MRRs), which were then compared to experimental copper chemical mechanical planarization (CMP) data.
Robin Ihnfeldt, Jan B. Talbot
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An Intelligent Approach for High Material Removal Rate Machining
2013Machining is one of the most important manufacturing processes. Material removal rate (MRR) is a crucial issue in machining, but it is limited by machining stability lobe which depends on cutting dynamics. This chapter investigates an intelligent approach for increasing MRR.
Jhy-Cherng Tsai, Shen-Jhy Wang
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Modeling Material Removal Rate of Heavy Belt-Grinding in Manufacturing of U71Mn Material
Key Engineering Materials, 2016The heavy belt-grinding is a new machining method, which combined the characters of heavy-duty grinding and belt-grinding together, with high efficiency and low cost. In the present paper the removal rate model of heavy belt-grinding in manufacturing of U71Mn steel is established. It is assumed that the distribution of the abrasive particles protrusion
Rong Quan Wang +3 more
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Analysis of the Material Removal Rate of Micro-Hole Machining of Ceramic Materials
Advanced Materials Research, 2011This study discussed what rotary ultrasonic machining (RUM) and tool geometry parameters combination can obtain bigger material removal rate (MRR) in drilling. The experimental configuration of this study was planned using Taguchi orthogonal array, where the drill diameter, rotation speed, power and feed rate were taken as the experimental factors.
Shu Lung Wang, Ting Yu Chueh
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Tribological approaches to material removal rate during chemical mechanical polishing
Metals and Materials International, 2013In this study, the effect of the friction and wear of a polishing pad on the material removal rate of a silicon oxide wafer was investigated during chemical mechanical polishing (CMP) with ceria slurry. Further, the effect of surface properties of the polishing pad, such as surface roughness and hardness, on the variation in the material removal rate ...
Hong Jin Kim +5 more
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