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Fracture mechanics stress analysis
1983In this chapter the boundary integral equation (BIE) method is discussed with particular reference to its application to fracture mechanics stress analysis. Although the BIE method has been used to treat a variety of boundary value problems, those encountered in fracture mechanics possess certain unique features which require special treatment.
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Transistors under stress: Mechanical stress affects amplification
2002Practically every modern Intel Pentium processor main board features a temperature sensor developed at Delft University of Technology. The sensor detects when the processor starts to become too hot, and switches on a fan to cool it down. As soon as the temperature drops to an acceptable level, the fan is switched off.
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