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Mechanical Properties of Thin Films

Optical Interference Coatings, 2007
A novel approach to mechanical properties of thin films based on combined nano-indentation and theoretical modelling is presented. It enables the determination of mechanical film parameters and predictive modelling of mechanical behaviour of thin films.
Frank Richter   +2 more
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Deformation Mechanisms in Thin Films

MRS Online Proceedings Library, 1992
There are a variety of different mechanisms which may contribute to the plastic deformation of a polycrystalline material, involving such processes as dislocation glide, dislocation climb, grain boundary sliding and diffusion of vacancies. Each mechanism can be characterized by a relationship which gives strain-rate as a function of stress, temperature
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Mechanical Behavior of Thin Films

MRS Bulletin, 1992
The use of materials based on their mechanical behavior has moderated key aspects of the development of civilization. Starting perhaps with stone and wood, used more or less in forms provided directly by nature, progressing to the ferrous metallurgies that gave birth to the entire industrial revolution, and continuing with today's exotic high-strength,
John C. Bravman, William D. Nix
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Thin film diamond growth mechanisms

Philosophical Transactions of the Royal Society of London. Series A: Physical and Engineering Sciences, 1993
The principal chemical mechanisms relevant to the growth of diamond from gaseous hydrogen and hydrocarbon species are presented. The kinetic processes occurring during the activation and transport of the gaseous species to the growing surface are described, with the key processes being the generation and subsequent reactions of gaseous atomic hydrogen.
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Thin film diamond growth mechanisms

1994
The principal chemical mechanisms relevant to the growth of diamond from gaseous hydrogen and hydrocarbon species are presented. The kinetic processes occurring during the activation and transport of the gaseous species to the growing surface are described, with the key processes being the generation and subsequent reactions of gaseous atomic hydrogen.
James E. Butler, Richard L. Woodin
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Mechanical Testing of Thin Films

MRS Proceedings, 1988
AbstractMetal films used as conductors in integrated circuits must be able to withstand stresses created during their deposition, caused by mismatches in thermal expansion coefficients and by bending which occurs during manufacture and installation. These stresses may be biaxial or uniaxial in nature.
C. T. Rosenmayer   +2 more
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Mechanical characterization of thin films

2014
The mechanical properties of brittle ZnO film and ductile Au film along with the proposed characterization methodologies are presented here. ZnO films with thicknesses ranging from 0.202 to 1.535 μm were deposited by using the magnetron sputtering technique on Si (100) substrates 525 μm thick. Then, Vickers indentation tests were carried out on the ZnO/
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Surface Segregation Mechanisms in Dielectric Thin Films

Integrated Ferroelectrics, 2004
It is often assumed that evaporation causes lead and bismuth depletion at the surface of ferroelectric films. However, this is in contrast with evidence that shows surface enrichment of Pb and Bi. A segregation mechanism that is analogous to the diffusion processes observed during the oxidation of metals is described. The presence of an electrochemical
Watts B.E. a   +5 more
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Mechanical testing of thin films

International Materials Reviews, 1994
The extensive use of thin films in the manufacture of microelectronic devices and for protection against wear and corrosion has stimulated considerable interest in their mechanical properties.
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CCD Chemical/Mechanical Thinning Results

SPIE Proceedings, 1989
Charge-coupled devices (CCDs) are becoming increasingly used as the primary detector for many astronomical imaging and spectroscopic instruments. The major limitations of front-illuminated CCDs in this field are their lack of blue and UV spectral response and relatively poor visible light response.
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