Results 211 to 220 of about 108,183 (279)
Defect Properties and Band Energetics of Atomic Layer Deposited MoOX on Crystalline Si
Atomic layer deposited MoOx thin films grown using oxygen plasma and ozone co‐reactants exhibit tunable defect densities and band energetics. Optical and X#x02010;ray photoelectron spectroscopies reveal oxygen#x02010;vacancy#x02010;induced defect and polaron states and their impact on band alignment at the c#x02010;Si/MoOx interface, providing insight ...
Namitha Dsouza +3 more
wiley +1 more source
Demographic differences in facial anthropometric data from 3D scans and implications for respirator fit. [PDF]
Hobbs-Murphy K +3 more
europepmc +1 more source
The article overviews past and current efforts on caloric materials and systems, highlighting the contributions of Ames National Laboratory to the field. Solid‐state caloric heat pumping is an innovative method that can be implemented in a wide range of cooling and heating applications.
Agata Czernuszewicz +5 more
wiley +1 more source
Recent research on laser‐processed cermets and cemented carbides highlights significant advancements, yet a notable paucity of studies and persistent challenges remain. Efforts are increasingly focused on developing low‐cost, environmentally friendly cermets as alternatives to conventional materials.
Himanshu Singh Maurya +2 more
wiley +1 more source
Research on the influence of spontaneous commercial space on the commercial vitality of historical and cultural districts. [PDF]
Wang R, Shang W, Zhang G.
europepmc +1 more source
Advanced Techniques for Scalable Woven E‐Textiles Manufacturing
This review highlights recent advances in scalable weaving techniques for e‐textiles, emphasizing innovations in multilayer structures, conductive yarn integration, and loom modifications. It summarizes emerging materials, fabrication strategies, and performance considerations that enable reliable, durable, and industrially scalable woven electronic ...
Faisal Abedin +2 more
wiley +1 more source
Advancements in TLP Bonding for Power Electronics Die‐Attach Applications
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal +4 more
wiley +1 more source
Digital Reconstruction: A Critical Examination of the History and Adaptation of Ku Klux Klan Websites. [PDF]
Kingdon A, Winter A.
europepmc +1 more source
This critical review presents a comprehensive roadmap for the precision 3D printing of cellulose. Quantitative correlations link ink formulation and rheological properties to print fidelity and final material performance. This framework guides the development of advanced functional materials, from biomedical scaffolds to electromagnetic shielding ...
Majed Amini +3 more
wiley +1 more source

