Results 1 to 10 of about 19,197 (308)

Solar cell metallization: Historical perspective

, 1983
Solar cell metallization design requirements are discussed. Space applications and terrestrial applications are considered.
Taylor, W. E.
core  

Synergistic Effects in Condensed DNA Framework‐Mediated Synthesis of Amorphous Nanoalloys for Enhanced Electrocatalytic Oxygen Evolution

Small Structures
Noble metal electrocatalysts exhibit excellent oxygen evolution reaction (OER) activity but are limited by high cost and scarcity. Amorphous nanoalloys (ANAs) offer promising alternatives, yet constructing amorphous structures at the nanoscale remains ...
Zhuang Cai, Rui Gao, Jianbang Wang, Huajie Liu   +3 more
doaj   +1 more source

Amorphous-like TiN Films as Barrier Layers for Copper

Crystals
The titanium nitride (TiN) columnar structure results in a rapid diffusion of copper atoms into the substrate along a vertical path. In this paper, the TiN columnar growth process was modified, which resulted in the deposition of amorphous-like films ...
Shicheng Han, Shicheng Yang, Xiaohong Zeng, Ying Wu, Tong Liu, Hu Wang, Sunan Ding   +6 more
doaj   +1 more source

Electroless metallization of plastics

, 2017
Artykuł stanowi przegląd literatury dotyczącej bezprądowego metalizowania tworzyw polimerowych. Przedstawiono podstawowe rodzaje metalizowania: na drodze wymiany, w wyniku redukcji pierwiastka metalicznego oraz autokatalityczne.
Stepczyńska, M., Moraczewski, K., Rytlewski, P., Jagodziński, B., Żenkiewicz, M.   +4 more
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Mechanism of Grain Densification in Nano- and Poly-Crystalline Cu Films and Its Impact in Advanced Metallization Processes

Crystals
We investigate the microstructural evolution of electrochemically deposited poly-crystalline Cu films during subsequent thermal process cycles at mild maximum temperatures, compatible with the integration in advanced metallization schemes for electronic ...
Brunella Cafra, Alessandra Alberti, Gaetano Calogero, Ioannis Deretzis, Antonio Landi, Daniele Pagano, Salvatore Sanzaro, Antonino La Magna   +7 more
doaj   +1 more source

Metallization problems with concentrator cells

, 1983
Cells used with concentrators have similar contact requirements to other cells, but operation at high intensity imposes more than the usual demands on the metallization.
Iles, P. A.
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Coverage and reliability improvement of copper metallization layer in through hole at BGA area during load board manufacture

Reviews on Advanced Materials Science
The dimple of ball grid array (BGA) area with 70 mm × 70 mm size on load board for high performance integrated circuit final test is investigated by shadow moire at first, the dimple of BGA area decreases from 184.3 to 97.1 μm when six additional ...
Zhu Kai, Xing Ruimin, Jiang Zhongming, Zhong Rongjun, Chen Liuming, Liu Jianhui, Miao Hua, Zhou Guoyun   +7 more
doaj   +1 more source

Synergies of electrochemical metallization and valance change in all-inorganic perovskite quantum dots for resistive switching

, 2018
The in‐depth understanding of ions' generation and movement inside all‐inorganic perovskite quantum dots (CsPbBr3 QDs), which may lead to a paradigm to break through the conventional von Neumann bottleneck, is strictly limited.
Ziyu Lv, Wang, Zhanpeng, Jinrui Chen, Liao, Qiufan, Wang, Yan, Roy, Vellaisamy A.L., Zongxiang Xu, Haiquan Shan, Yan Wang, Chen, Jinrui, Yu-Jia Zeng, Shan, Haiquan, Zhou, Li, Li Zhou, Vellaisamy A. L. Roy, Yu‐Jia Zeng, Qiufan Liao, Xu, Zongxiang, Xiaoli Chen, Zeng, Yu-Jia, Zhanpeng Wang, Su‐Ting Han, Su-Ting Han, Lv, Ziyu, Han, Su-Ting, Zhou, Ye, Ye Zhou, Chen, Xiaoli   +27 more
core   +1 more source

Aerosol fluxing in electro arc metallization [PDF]

, 2017
© Published under licence by IOP Publishing Ltd. The main structural and technological factors of electric arc metallizers, which significantly affect the quality of their operation, are considered.
Kuznetsov Y., Sharifullin S., Logachev V., Solovev R., Denisov V., Kolomeichenko A.   +5 more
core  

Sub-Half Micron Electroless Cu Metallization

, 1996
Electroless Cu metallization has been fabricated by blanket electroless Cu deposition into the trenches in SiO2 dilectric layer on sputtered Cu seed layer with Ta diffusion layer and Al protection layer.
V. M. Dubin, B. Zhao, C. H. Ting, Y. Shacham-Diamand, P. K. Vasudev   +4 more
core   +1 more source