Results 31 to 40 of about 19,197 (308)
Preparation and temperature cycling reliability of electroless Ni(P) under bump metallization [PDF]
, 2007 The reliability of electroless Ni(P) under-bump metallization (UBM) was evaluated via temperature cycling and solder bump shear strength tests. Commercial diodes and dummy dies fabricated in-house were used as substrates for the electroless Ni(P) UBM ...
Chen, Weimin +9 more
core +1 more source
Study of structure and surface morphology of two-layer contact Ti/Al metallization
Modern Electronic Materials, 2016 Ti/Al/Ni/Au metallization widely used in the technology of GaN base devices have a very important imperfection i.e. rough surface. There are different opinions about the causes of this imperfection: balling-up of molten aluminum or the appearance of ...
Kirill D. Vanyukhin +4 more
doaj +1 more source
Metallisation of Textiles and Protection of Conductive Layers: An Overview of Application Techniques
Sensors, 2021 The rapid growth in wearable technology has recently stimulated the development of conductive textiles for broad application purposes, i.e., wearable electronics, heat generators, sensors, electromagnetic interference (EMI) shielding, optoelectronic and ...
Alenka Ojstršek +6 more
doaj +1 more source
Stress Analysis of Tungsten Deposition in a 3D Trench Mold With Regard to Initial Nuclei Shape
IEEE Access, 2022 Tungsten has been commonly used for fine interconnects due to its good gap-filling characteristics in 3D molds, such as trench patterns. However, tungsten shows high deposition stress. This causes mold distortion because tungsten has low ad-atom mobility,
Jong-Sung Lee +4 more
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Radiation technology for improvement of ohmic contacts to the electronic device elements [PDF]
Tekhnologiya i Konstruirovanie v Elektronnoi Apparature, 2010 Two types of metallization (Au, Ti) to a fullerene-bearing material are investigated. The advantages of microwave annealing are noted. Microwave annealing of polymer-fullerene layers with both metallizations is studied; the resistance decreases in both ...
Konakova R. V. +4 more
doaj +2 more sources
Design Rules for Solar Cells with Plated Metallization
, 2022 8492This work deals with requirements regarding the solar cell process that allow or facilitate the introduction of fabrication processes for front side metallization.
Cimiotti, Gisela +4 more
core +1 more source
Micromachines, 2023 Emerging trends like the Internet of Things require an increasing number of different sensors, actuators and electronic devices. To enable new applications, such as wearables and electronic skins, flexible sensor technologies are required.
Franz Selbmann +6 more
doaj +1 more source
Cobalt advanced barrier metallization: A resistivity composition analysis
, 2022 S.11-15Cobalt is a high-potential material applicable as liner and seed replacement in BEoL metallization schemes. To enable seedless plating, the resistivity of thin cobalt liners (
Wislicenus, M. +4 more
core +1 more source
Optical basicity and electronic polarizability of zinc borotellurite glass doped La3+ ions
Results in Physics, 2017 Zinc borotellurite glasses doped with lanthanum oxide were successfully prepared through melt-quenching technique. The amorphous nature of the glass system was validated by the presence of a broad hump in the XRD result.
M.K. Halimah +3 more
doaj +1 more source
METHOD OF IONIC MIXING FOR SILICIDE LAYER FORMATION
Физико-химические аспекты изучения кластеров, наноструктур и наноматериалов, 2020 Ion implantation with recoil ions or ion mixing based on the introduction of the required impurity from the surface layers during the transfer of the kinetic energy of the primary beam to them have great prospects for obtaining structures and compounds ...
G.A. Mustafaev +3 more
doaj +1 more source