Results 41 to 50 of about 19,197 (308)

Plated TOPCon solar cells & modules with reliable fracture stress and soldered module interconnection

EPJ Photovoltaics, 2021
This work demonstrates that the application of plated Ni/Cu/Ag contacts for TOPCon solar cells and modules is a reliable alternative to screen-printed metallization.
Kluska Sven, Grübel Benjamin, Cimiotti Gisela, Schmiga Christian, Berg Heinrich, Beinert Andreas, Kubitza Irene, Müller Paul, Voss Torsten   +8 more
doaj   +1 more source

Advanced Metallization with Low Silver Consumption for Silicon Heterjunction Solar Cells

, 2022
Art. 020007, 9 S.In this work, three industry-related metallization approaches for silicon heterojunction (SHJ) solar cells are presented which are aiming for a reduction of silver consumption compared to conventional screen-printing of low-temperature ...
Glunz, Stefan W., Keding, Roman, Schube, Jörg, Fellmeth, Tobias, Jahn, Mike   +4 more
core   +1 more source

Metal Metal

Artilugio, 2023
METAL METAL es una pieza electroacústica creada en 2022. El material sonoro utilizado en la composición fue grabado durante la pandemia mundial de Covid-19. Aprovechando el aislamiento obligatorio, se realizaron sesiones de improvisación rítmica, tímbrica y textural con latas de aluminio. Estas se registraron con un grabador digital Zoom H4.
openaire   +1 more source

A Study on Sputtering of Copper Seed Layer for Interconnect Metallization via Molecular Dynamics Simulation

Applied Sciences, 2021
Interconnects are significant elements in integrated circuits (ICs), as they connect individual components of the circuit into a functioning whole. To form a void-free interconnect, a thin and uniform copper seed layer must be deposited as a basis for ...
Cheng-Hsuan Ho, Cha’o-Kuang Chen, Chieh-Li Chen   +2 more
doaj   +1 more source

FoilMet® - Connect: A New Rear Metallization Upgrade for PERC and other Cell Concepts

, 2020
Art. 020004, 6 S.In this contribution the novel aluminum foil based rear metallization technology FoilMet® - Connect is introduced. With this technology, we combine the optical advantages of a foil metallized rear, known from FoilMet® - Classic and the ...
Paschen, Jan, Nekarda, Jan, Brand, Andreas, John, Oliver, Emanuel, Gernot, Fellmeth, Tobias, De Rose, Angela   +6 more
core   +1 more source

Features Multilevel Metallization Forming a Submicron Structures of Large Integrated Circuits

Фізика і хімія твердого тіла, 2017
This paper analyzesaluminum alloys that are used to form multilevel metallization in the submicron LSI/VLSI and magnetic alloys that are used for the production of magnetic disks of external storage devices with a large amount of memory.
S. P. Novosyadlyj, S. I. Boyko, M. V. Kotyk   +2 more
doaj   +1 more source

Metallization of Extruded Briquettes (BREX) in Midrex Process

Metals, 2017
The results of the full-scale testing of the Extruded Briquettes (BREX) as the charge components of the industrial Midrex reactor are discussed. The influence of the type of binder on the degree of metallization of BREX is analyzed.
Aitber Bizhanov, Tatyana Malysheva
doaj   +1 more source

Superconductivity in Group III-V Semiconductor AlN Under High Pressure

Orbital: The Electronic Journal of Chemistry, 2015
The electronic properties of cubic zinc blende type group III-V semiconductor AlN under pressure is studied using full potential linear muffin-tin orbital (FP-LMTO) method.
G. Selva Dancy, V. Benaline Sheeba, C. Nirmala Louis, A. Amalraj   +3 more
doaj   +1 more source

Advances with resist-free copper plating approaches for the metallization of silicon heterojunction solar cells

, 2019
Art. 020010, 5 S.The metallization of silicon heterojunction (SHJ) solar cells by selective Cu electroplating without any resist-mask is in development.
Markus Glatthaar, Glatthaar, Markus, Jonas Bartsch, Bartsch, Jonas, Sven Kluska, Hatt, Thibaud, Kluska, Sven, Franzl, Yannick, Thibaud Hatt, Yannick Franzl   +9 more
core   +1 more source

Enhanced Simulation Accuracy and Design Optimization in Power Semiconductors Through Individual Aluminum Metallization Layer Modeling

Energies
This study investigates the impact of modeling the aluminum (Al) metallization layer as an integrated part of the chip model, versus as an individual component, on the results of electrical–thermal analysis of power semiconductor packages using Finite ...
Na-Yeon Choi, Sang-Gi Kim, Sung-Uk Zhang
doaj   +1 more source