Results 41 to 50 of about 1,118 (118)
, 2013 This chapter deals with the electronic structure of metal-metal bonds in molecular systems, a diverse topic that now spans almost the entire periodic table. The field is most often associated with strong multiple bonds such as the iconic quadruple bond in [Re2Cl8]2-, and the recently discovered ultra-short Cr-Cr quintuple bonds provide a remarkable ...
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Surface metallization and application of ultra-high molecular weight polyethylene fiber
Shenzhen Daxue xuebao. Ligong banUltra-high molecular weight polyethylene (UHMWPE) fibers and fabrics suffer from weak interfacial bonding with composite matrix due to their chemically inert surface and high crystallinity, thereby affecting the performance of composite materials.
YU Jiali +4 more
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Materials Research, 2009 Thin films of titanium were deposited onto Al2O3 substrate by hollow cathode discharge method for the formation of a ceramic-ceramic joint using indirect brazing method.
Mary Roberta Meira Marinho +4 more
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Journal of Asian Ceramic SocietiesThe effects of surface roughness and microtopography of AlN substrate on the interface mechanical behavior of AlN/Ag structures were studied by experimental and numerical simulation methods.
Lingling Liu, Baoseng Wang, Guijing Li
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Materials Quest for Advanced Interconnect Metallization in Integrated Circuits
Advanced Science, 2023 Integrated circuits (ICs) are challenged to deliver historically anticipated performance improvements while increasing the cost and complexity of the technology with each generation.
Jun Hwan Moon +7 more
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Amorphous-like TiN Films as Barrier Layers for Copper
CrystalsThe titanium nitride (TiN) columnar structure results in a rapid diffusion of copper atoms into the substrate along a vertical path. In this paper, the TiN columnar growth process was modified, which resulted in the deposition of amorphous-like films ...
Shicheng Han +6 more
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CrystalsWe investigate the microstructural evolution of electrochemically deposited poly-crystalline Cu films during subsequent thermal process cycles at mild maximum temperatures, compatible with the integration in advanced metallization schemes for electronic ...
Brunella Cafra +7 more
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Reviews on Advanced Materials ScienceThe dimple of ball grid array (BGA) area with 70 mm × 70 mm size on load board for high performance integrated circuit final test is investigated by shadow moire at first, the dimple of BGA area decreases from 184.3 to 97.1 μm when six additional ...
Zhu Kai +7 more
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The method to obtain of the aggloburden sintering material using the conversion of natural gas
Metalurgija, 2019 The paper considers the processes of direct production of iron from ores, which a re called solid-phase reduction processes. A technology for the production of metallized agglomerate is proposed, consisting of two stages: sintering of agglomerate and ...
S. E. Shipilov +6 more
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Metal-metal bond lengths in complexes of transition metals [PDF]
Proceedings of the National Academy of Sciences, 1976 In complexes of the transition metals containing clusters of metal atoms the cobalt-cobalt bond lengths are almost always within 1 pm of the single-bond value 246 pm given by the enneacovalent radius of cobalt, whereas most of the observed iron-iron bond lengths are significantly larger than the single-bond value 248 pm, the mean ...
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