Results 121 to 130 of about 385 (173)
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Environmental influences on microassembly
IEEE/RSJ International Conference on Intelligent Robots and System, 2003Environmental conditions, such as temperature and humidity can influence the adhesion forces and microtribological properties of microparts. To have a good understanding of microassembly, it is essential to study the influences of environmental conditions to microassembly process and system.
Quan Zhou 0001 +4 more
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Caging micromanipulation for automated microassembly
2011 IEEE International Conference on Robotics and Automation, 2011This paper introduces the concept of caging micromanipulation for use in automated open loop microassembly tasks. Utilizing a caging transport motion primitive along with rotational and translation primitives, we demonstrate full control of the state of the part.
David J. Cappelleri +2 more
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Standing wave probes for microassembly
Review of Scientific Instruments, 2008A single standing wave sensor was investigated and experiments demonstrated release capability of glass microscale objects. It is shown that this micrometer scale fiber may be employed as miniaturized tweezers able to pick up specimens and routinely release them when the standing wave is energized. Furthermore, it is demonstrated that the standing wave
Shane, Woody +3 more
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Optical tweezers in microassembly
SPIE Proceedings, 2013Integrated hybrid MEMS require new micromanipulation devices in assembly processes. Although absolute forces are restricted optical tweezers are promising tools with unique advantages. Recent developments in beam shaping allow the control of a large number of different particles.
A. Ostendorf, R. Ghadiri, S. I. Ksouri
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Microassembly by intermolecular forces
Journal of Applied Crystallography, 1988The value of neutron and X-ray small-angle scattering for studying self assembly of molecular-sized units into interesting chemical and electrical structures is illustrated with three different types of system. The amphiphilic nature of a polyacetylene-polyisoprene [(CH)xPI] AB block copolymer and some of the structure arising from this are seen in ...
S. J. Henderson, J. W. White
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Technology for Microassembling
MRS Proceedings, 1996Abstract The various problem areas regarding assembling of microelements into complex microsystems are reviewed and the joining techniques are emphasised in particular. The dis,-ussion is focused on the fabrication of microrobotic systems and the various joining techniques are compared with respect to the potential of fulfilling the ...
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Stereophotogrammetry in Microassembly
2011Hybrid microsystems are preferably assembled serially by robots, which place the individual components successively in their intended locations. Microassembly processes are subject to various influences, which often consume a considerable part of the specified tolerance.
C. Keck, M. Berndt, R. Tutsch
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ACM SIGMICRO Newsletter, 1977
The microprogrammed Data General Eclipse S/200 computer is available with a writable control store (WCS). The WCS feature of the Eclipse is an extension of the microprogrammed control logic of the computer's central processing unit. It allows a user to implement specialized instructions at a very low level.
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The microprogrammed Data General Eclipse S/200 computer is available with a writable control store (WCS). The WCS feature of the Eclipse is an extension of the microprogrammed control logic of the computer's central processing unit. It allows a user to implement specialized instructions at a very low level.
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A Flexible Microrobot-Based Microassembly Station
Journal of Intelligent and Robotic Systems, 2000The assembly of complex microsystems consisting of several single components (i.e. hybrid microsystems) is a difficult task that is seen to be a real challenge for the robotic research community. It is necessary to conceive flexible, highly precise and fast microassembly facilities.
Fatikow, Sergej +4 more
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Microassembly technologies for MEMS
SPIE Proceedings, 1998Microassembly promises to extend MEMS beyond the confines of silicon micromachining. This paper surveys research in both serial and parallel microassembly. The former extends conventional pick and place assembly into the micro-domain, where surface forces play a dominant role.
Michael B. Cohn +6 more
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