Results 161 to 167 of about 2,189 (167)
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Technology tools for a high precision accelerometer in bulk micromechanics
Microsystem Technologies, 1994The high precision accelerometer consists of 5 silicon wafers and packages by silicon fusion bonding. The sensor has a capacitance measuring principle and works in an open loop or closed loop operation mode. The etching process for the realization of thin beams and seismic mass, the silicon fusion bonding and the metallization process are described.
T. Geßner, E. Vetter, M. Wiemer
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Study on Packaging Thermal Stress of Micromechanical Silicon Resonant Accelerometer
Applied Mechanics and Materials, 2013Packaging thermal stress is harmful to the performance of the micromechanical silicon resonant accelerometer. In order to decrease the packaging thermal stress, correlations of packaging thermal stress with the material properties, curing temperature and geometrical size of adhesive layers of adhesive materials were discussed. A finite element model of
Li Bin Huang +3 more
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Design of the Analog Front-End for the Micromechanical Accelerometer
2020The given work is devoted to the design of the analog front-end of the capacitive MEMS accelerometer. In the following thesis the basic capacitive accelerometer ASIC design approaches are discussed. The main error sources in such systems are analyzed.
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Development and research of a micromechanical accelerometer sensor element
International Conference on Micro- and Nano-Electronics 2021, 2022Viktor Kalugin +4 more
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Micromechanical accelerometer for automotive applications
Smart Materials Bulletin, 2001openaire +1 more source
Micromechanical three axis capacitive accelerometer
2012FRANGI, ATTILIO ALBERTO +2 more
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