Results 151 to 160 of about 11,269 (214)

A Multilevel Intervention to Identify Individuals for Genetic Testing and Treatment: The IGNITE-TX Pilot Randomized Clinical Trial.

open access: yesJAMA Netw Open
Jorgensen KA   +19 more
europepmc   +1 more source

MEMS-4-MMIC: Advances in combined GaAs MEMS-MMIC technology

open access: yes2010 14th International Symposium on Antenna Technology and Applied Electromagnetics & the American Electromagnetics Conference, 2010
This article describes the progress made during the first project year of the FP7 EU-project MEMS-4-MMIC that focuses on the merging of innovative RF-MEMS switch designs with established MMIC-technology. The ultimate goal is to include RF-MEMS switches into a standard commercial foundry process.
Baggen, L.   +5 more
core   +6 more sources
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Low-Loss 140-175 GHz MMIC-to-Waveguide Transitions and MMIC-to-MMIC Interconnections

2021 51st European Microwave Conference (EuMC), 2022
Xiaobang Shang, Nick M Ridler
exaly   +2 more sources

MMIC transmission lines for multi-layered MMICs

1991 IEEE MTT-S International Microwave Symposium Digest, 2002
Multilayered MMIC (monolithic microwave integrated circuit) transmission line configurations are proposed, and their performance is experimentally investigated. Four transmission line structures have been fabricated using polyimide films: (1) microstrip line with overlay, (2) inverted microstrip line, (3) trapezoid microstrip line, and (4) valley ...
H. Ogawa   +3 more
openaire   +1 more source

Uniplanar MMIC Hybrids--A Proposed New MMIC Structure

IEEE Transactions on Microwave Theory and Techniques, 1987
A new "uniplanar" circuit configuration for monolithic microwave integrated circuits (MMIC's) has been proposed. It uses a combination of coplanar waveguides and slotlines on one side of the substrate. The key components for the uniplanar structure are air bridges, which provide T junctions and transitions from coplanar waveguides to slotlines or vice ...
T. Hirota, Y. Tarusawa, H. Ogawa
openaire   +1 more source

Interconnects And Packaging For MMIC's

27th European Microwave Conference and Exhibition, 1997
This contribution reviews a number of aspects relevant for interconnects and packaging of monolithic integrated millimeter-wave circuits, possibly combined with hybrid or even waveguide circuits. Topics are packaging and front-end architecture, package materials, and standard interconnects to microstrip or coplanar MIMIC's.
openaire   +1 more source

Three-dimensional MMIC technology for low-cost millimeter-wave MMICs

IEEE Journal of Solid-State Circuits, 2001
This paper highlights the key advantages of the three-dimensional (3-D) MMIC technology in the millimeter-wave frequency band and describes recently developed compact 3-D MMICs on GaAs and Si substrates. The 3-D MMIC technology offers high integration levels, compactness, simple design procedures, and short fabrication turn-around time, resulting in ...
Kenjiro Nishikawa   +6 more
openaire   +2 more sources

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