Results 111 to 120 of about 123,395 (163)

Creative Packaging Design for Products

2021
The packaging is part of the final product and its ergonomic design becomes a purchase motivator. They fulfill different functions, such as: protector, conservator and provides logistical security of the product, among others. The use of technological tools as a transforming element in digitization, printing and prototyping accelerates the process and ...
Carlos Borja-Galeas, Hugo Arias-Flores, Janio Jadán-Guerrero   +2 more
openaire   +1 more source

Design for packageability-early consideration of packaging from a VLSI designer's viewpoint

Computer, 1993
Designing VLSI dies without considering packaging issues may result in a suboptimum system. It is argued that before the design of VLSI dies is completed, packaging issues should be evaluated, since they may affect choices in VLSI circuit design and layout.
Peyman H. Dehkordi, Donald W. Bouldin
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Interconnection effects in Package on Package design

2007 IEEE Workshop on Signal Propagation on Interconnects, 2007
The PoP (Package on Package) design procedure is described in this paper, focusing principally on the constraints and the system characteristics. The PoP structure is more and more diffused because it increases the customer flexibility and the final yield by means of a separate testing of Top and Bottom devices.
P. Pulici, G. Candela, G. Campardo, G. P. Vanalli, P. P. Stoppino, A. Losavio, T. Lessio, M. Dellutri, D. Guarnaccia, F. Lo Iacono   +9 more
openaire   +1 more source

Thermal design optimization of a package on package

2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2009
In the past decade, compact components such as Chip Scale Packages and flip chips were the work horses of miniaturization. However, emerging applications are now demanding even higher packaging density. In order to fulfill this requirement, three dimensional packaging was evolved.
Abhilash R. Menon, Saket Karajgikar, Dereje Agonafer   +2 more
openaire   +1 more source

Mechanical Design Optimization of a Package on Package

ASME 2009 InterPACK Conference, Volume 2, 2009
In the past decade, compact components such as Chip Scale Packages and flip chips were the work horses of miniaturization. However, emerging applications are now demanding even higher packaging density. In order to fulfill this requirement, three dimensional packaging was evolved.
Abhilash R. Menon, Nikhil Lakhkar, Saket Karajgikar, Dereje Agonafer   +3 more
openaire   +1 more source

French databases for packagings complying with approved package design and for approval certificates of package design

Packaging, Transport, Storage & Security of Radioactive Material, 2009
AbstractThe transport of radioactive material in France concerns the nuclear fuel cycle, research, medical use and inspections in civil industry and real estate. Some of these transports are performed with packages, the design of which must be approved by the competent authority.
K. Ben Ouaghrem, M.-T. Lizot
openaire   +1 more source

A Shape Optimal Design Methodology for Packaging Design

Journal of Electronic Packaging, 1992
Shape optimal design methodology has been used as a design tool in the automotive and aerospace industries for quite some time now. In the present work the hybrid natural shape optimal design approach is used along with a nonlinear programming (NLP) technique to find the optimal shapes of electronic packaging components.
S.D. Rajan, B. Nagaraj, M. Mahalingam
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A package for filter design based on MATLAB

31st Annual Frontiers in Education Conference. Impact on Engineering and Science Education. Conference Proceedings (Cat. No.01CH37193), 2001
AbstractElectric filters have a relevant importance in electronic systems because they are present in almost any electronic system. For example, communication systems, as many other electric systems, make intensive use of filtering to separate unwanted noise from the desired signal.
David Báez-López, David Báez-Villegas, René Alcántara, Juan José Romero, Tomás Escalante   +4 more
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Package On Package (PoP) Design and Assembly

On-Demand Webinars, 2012
ABSTRACT Package on Package (PoP) applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on assembly engineers. In simple terms POP represents the stacking of components one on top of another either during the original component manufacture or during ...
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The design of a terminal independent package

Software: Practice and Experience, 1987
AbstractChareacter‐mapped display terminals very considerably. TIP is a Terminal Independent Package which conceals the details of efficiently handling terminal protocols from applications programs. There is a conflict between the ability to handle esoteric terminal features and providing a uniform programmer's interface for all terminals.
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