Results 1 to 10 of about 1,418,608 (117)
Study of robust package strength characterization of memory packages for handheld application
Memories - Materials, Devices, Circuits and Systems, 2022 In mobile market, the demand of memory packaging increase year over year. While the form factor of memory packages moves toward smaller and thinner geometry with higher pin counts, the package overall mechanical robustness becomes one of a key criteria ...
Vance Liu +4 more
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Journal of Materials Research and Technology, 2023 The influence of basalt fiber (BF) on the mechanical properties of reactive powder concrete (RPC) under different curing systems was studied. Three curing systems were adopted: natural curing (NC), standard curing (SC) and combined curing (CC).
Lincai Ge +3 more
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Journal of Advanced Joining Processes, 2022 Flex-on-board (FOB) interconnection plays an important role in display applications. Due to the thinness of the interconnect, the contact resistance of anisotropic conductive film (ACF) joints is very small; however, the transmission property of ACF ...
Shuye Zhang +6 more
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Zbornik Radova: Pravni Fakultet u Novom Sadu, 2013 It is duty of the seller to pack the goods in a manner which assures their safe arrival and enables their handling in transit and at the place of destination. The problem of packing is relevant in two main respects.
Arsić Zoran
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Glass Package for Radar MMICs Above 150 GHz
IEEE Journal of Microwaves, 2022 This work presents a novel sensor packaging and a novel transition concept for radar applications above 150 GHz based on glass material. By using laser induced deep etching (LIDE) technology, glass vias and cavities are fabricated without degrading the ...
Thomas Galler +7 more
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Resolution-Enhancing Structure for the Electric Field Microsensor Chip
Micromachines, 2021 Electrostatic voltage is a vital parameter in industrial production lines, for reducing electrostatic discharge harms and improving yields. Due to such drawbacks as package shielding and low resolution, previously reported electric field microsensors are
Xiaolong Wen +8 more
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Automated system for gluing parts of paper packages
Вісник Харківського національного університету імені В.Н. Каразіна. Серія: Математичне моделювання, інформаційні технології, автоматизовані системи управління, 2023 Relevance. Gift and souvenir products are usually presented in paper bags. Research and development of practical solutions for automating the process of gluing package parts is an urgent scientific problem and engineering task. This article discusses the
Валерій Яланецький
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Active and Passive Electronic Components, 2002 Embedded capacitor technology can improve electrical performance and reduce assembly cost compared with traditional discrete capacitor technology. Polymer–ceramic composites have been of great interest as embedded capacitor material because they combine ...
Yang Rao, Jireh Yue, C. P. Wong
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Modeling of Voltage-Controlled Oscillators Including I/O Behavior Using Augmented Neural Networks
IEEE Access, 2019 This paper proposes augmented neural networks (AugNNs) for modeling the behavior of steady-state oscillators in time-domain. Multi-output AugNNs with the corresponding gradient scheme and training methodology are proposed for the modeling of multi-phase ...
Huan Yu +2 more
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Educational and knowledge gaps within the European reference network on rare endocrine conditions
Endocrine Connections, 2021 Objective: The European Reference Network on Rare Endocrine Conditions (Endo-ERN), operational since 2017, consists of 71 health care providers (HCPs) in 19 EU member states.
Violeta Iotova +7 more
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