Results 11 to 20 of about 1,418,757 (266)

A Hybrid Methodology for Jitter and Eye Estimation in High-Speed Serial Channels Using Polynomial Chaos Surrogate Models

open access: yesIEEE Access, 2019
Estimation of jitter and eye diagram in high-speed serial channels can be challenging. The existing methods might fail to show inter-symbol interference (ISI) and data dependent jitter because they are either excessively time consuming or only applicable
Majid Ahadi Dolatsara   +3 more
doaj   +1 more source

The Influence of Package Attributes on Consumer Perception among Generation Y

open access: yesEuropean Journal of Business Science and Technology, 2015
The article focuses on how milk packaging is perceived by generation Y. The required data were obtained through eye-tracking using the SMI RED 250 device.
Martin Souček   +4 more
doaj   +1 more source

Development of a Friction-Driven Finite Element Model to Simulate the Load Bridging Effect of Unit Loads Stored in Warehouse Racks

open access: yesApplied Sciences, 2021
Current pallet design methodology frequently underestimates the load capacity of the pallet by assuming the payload is uniformly distributed and flexible.
Eduardo Molina   +2 more
doaj   +1 more source

The R package EchoviewR for automated processing of active acoustic data using Echoview

open access: yesFrontiers in Marine Science, 2015
Acoustic data is time consuming to process due to the large data size and the requirement to often undertake some data processing steps manually. Manual processing may introduce subjective, irreproducible decisions into the data processing work flow ...
Lisa-Marie Katarina Harrison   +4 more
doaj   +1 more source

Packaging Models versus Modeling Packaging [PDF]

open access: yesBiophysical Journal, 2016
For over 50 years, bacteriophage have stood as some of the most informative systems used to investigate the fundamental aspects of macromolecular interaction and allostery, yielding insight into how complex structures form. The tractable nature of these systems presents both the simplicity needed to rapidly adopt and develop new experimental ...
openaire   +2 more sources

Broadband power amplifier limitations due to package parasitics [PDF]

open access: yesSerbian Journal of Electrical Engineering, 2015
Limitations of CMOS broadband power amplifiers due to package parasitics have been explored in this paper. The constraints of power amplifier matching network, realized as a third-order Chebyshev filter, have been derived, and a new power ...
Grujić Dušan N., Saranovac Lazar
doaj   +1 more source

Re-Absorption Effect Modeling for Dual-Layer Phosphor Package of White LEDs

open access: yesIEEE Photonics Journal, 2021
This paper successfully establishes an optical model with dual green/red phosphor layers based on the original single-phosphor model. Since the re-absorption effect of double-layer phosphors causes spectral distortion, the model must introduce a ...
Ching-Cherng Sun   +4 more
doaj   +1 more source

Antenna-in-Package Using IC-Embedded Metal Fan-Out Wafer-Level Package for D-Band Applications

open access: yesIEEE Access
In this study, we present a low interconnection loss antenna-in-package (AiP) using a chip-embedded metal fan-out wafer-level package (mFOWLP) technology for D-band (110–170 GHz) applications. The package configuration enables interconnection with
Ju-Yong Lee   +3 more
doaj   +1 more source

The Dichotomy of Cold and Heat in the Packaging of Stumbras Vodka Premium Organic

open access: yesSemiotika (Vilniaus universitetas), 2016
Over the last few decades we may discover and follow the significant changes extending in the segment of vodka. The globalgrowth of vodka usage publicly proportionally supplements the demand of the image value.
Edvardas Kavarskas
doaj   +1 more source

Control of Package Warpage by Package Substrate Design for Low Profile Package-on-Package Structure

open access: yesInternational Symposium on Microelectronics, 2012
In recent years, with increasing demand for high-density assembly in mobile electronics products, a package-on-package (PoP) structure has been standardized. The demand for lowering the PoP profile is getting stronger as consumers demand thinner mobile devices.
Furusawa, T   +3 more
openaire   +2 more sources

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