Results 121 to 130 of about 45,985 (302)
Fabrication of High‐Density Multimodal Neural Probes Based on Heterogeneously Integrated CMOS
Advanced Science, EarlyView.A chiplet‐based methodology democratizes active neural probe development on standard bulk CMOS services. This yields the first probe combining high‐density electrophysiology (416 electrodes) with calcium imaging (832 photodiodes) and complete on‐chip signal processing across 13 shanks.
Ju Hee Mun +10 more
wiley +1 more source
3D Energy Harvester Evaluation [PDF]
, 2013 This paper discusses the characterization and evaluation of an MEMS based electrostatic generator, a part of the power supply unit of the self-powered microsystem[1,2,3].
Husak, M., Janicek, V.
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Advances and Perspectives in Graphene‐Based Quantum Dots Enabled Neuromorphic Devices
Advanced Science, EarlyView.Graphene‐based QDs are zero‐dimensional carbon nanomaterials with pronounced quantum confinement and tunable electronic structures. Herein, we summarize their synthesis strategies and functionalization methods, and highlight their functional roles and operating mechanisms in devices, as well as recent advances in neuromorphic electronics. We anticipate
Yulin Zhen +9 more
wiley +1 more source
SmartMatIn integrated circuits (ICs), the parasitic capacitance is one of the crucial factors that degrade the circuit dynamic performance; for instance, it reduces the operating frequency of the circuit.
Baichuan Jiang +14 more
doaj +1 more source
Analysis of the high-speed polysilicon photodetector in fully standard CMOS technology [PDF]
, 2003 A high-performance lateral polysilicon photodiode was designed in standard 0.18 um CMOS technology. The device has a frequency bandwidth far in the GHz range: the measured bandwidth of the poly photodiode was 6 GHz, which gure was limited by the ...
Annema, A.J. +2 more
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Advanced Electronic Materials, EarlyView.This paper reviews the physics of liquid metals in RF devices, including the influence of mechanical strain on resonance as well as fabrication methods and strategies for designing tunable and strain‐tolerant inductors, capacitors, and antennas.
Md Saifur Rahman, William J. Scheideler
wiley +1 more source
Ultra Sensitive PIN-Diode Receiver Utilizing Photocurrent Integration on a Parasitic Capacitance
IEEE AccessThis work presents a highly sensitive monolithic optical receiver in $\mathrm {0.35~\mu m}$ CMOS. The integrator-based frontend employs periodic photocurrent integration on a parasitic capacitance in combination with an ultra-low-capacitance PIN ...
Christoph Gasser +3 more
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, 1973 A phototransistor is described in which there is included as a part of its integral structure an auxiliary diode in the form of an added base-collector junction.
Mccann, D. H.
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Advanced Electronic Materials, EarlyView.A physics‐based compact model for Conductive‐Metal‐Oxide/HfOx ReRAM, accounting for ion dynamics, electronic conduction, and thermal effects, is presented. Accurate and versatile simulations of analog non‐volatile conductance modulation and memory state stabilization enable reliable circuit‐level studies, advancing the optimization of neuromorphic and ...
Matteo Galetta +9 more
wiley +1 more source
Accurate a priori signal integrity estimation using a multilevel dynamic interconnect model for deep submicron VLSI design. [PDF]
, 2000 A multilevel dynamic interconnect model was derived for accurate a priori signal integrity estimates. Cross-talk and delay estimations over interconnects in deep submicron technology were analyzed systematically using this model.
Pamunuwa, Dinesh B. +2 more
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