Results 61 to 70 of about 31,465 (305)
Microfabrication of Ni-Fe Mold Insert via Hard X-ray Lithography and Electroforming Process
Metals, 2020 In this research, a Ni-Fe mold insert for the efficient replication of high aspect-ratio microstructure arrays was fabricated via hard X-ray lithography and an electroforming process.
Jae Man Park +7 more
doaj +1 more source
Biodegradable Conductors for Implantable and Wearable Transient Bioelectronics
Advanced Functional Materials, EarlyView.Biodegradable conductors are essential building blocks for transient bioelectronics, enabling temporary sensing, stimulation, and energy transfer while eliminating the need for device retrieval. This review summarizes biodegradable metals, conducting polymers, ionic conductors, and conductive composites, highlighting degradation mechanisms, material ...
Yicheng Zhu, Yijun Liu, Naoji Matsuhisa
wiley +1 more source
Simulation and optimization of holographically exposed photoresist gratings
, 2022 S.244-249Standard approaches of lithographic process simulation have been applied to the simulation of holographically exposed photoresist gratings.
Erdmann, A. +3 more
core +1 more source
Evaluation of replicas manufactured in a 3D-printed nanoimprint unit
Beilstein Journal of Nanotechnology, 2018 Nanoimprint lithography has become a useful tool to prepare elements containing nanoscale features at quite reasonable cost, especially if the fabrication elements are created in the own laboratory.
Manuel Caño-García +4 more
doaj +1 more source
Sensors, 2009 A novel plastic packaging of a piezoresistive pressure sensor using a patterned ultra-thick photoresist is experimentally and theoretically investigated. Two pressure sensor packages of the sacrifice-replacement and dam-ring type were used in this study.
Wood-Hi Cheng +3 more
doaj +1 more source
Доклады Белорусского государственного университета информатики и радиоэлектроники, 2020 The study is devoted to the research of the dependence of the processing results of photoresistive films on the silicon wafers surface in an ozone environment on the conditions and parameters of the process.
O. I. Tsikhan +4 more
doaj +1 more source
Advanced Functional Materials, EarlyView.Elastomeric micropillars bend under contact loading, sliding microscale devices out of alignment during transfer printing. A hybrid PDMS stamp embeds a high‐modulus skeleton within each pillar while retaining a compliant contact surface. The reinforcement confines pillar deformation, suppressing interfacial sliding and preserving array registration on ...
Seol Ahn +8 more
wiley +1 more source
, 2010 Major challenges associated with 193 nm lithography using an ArF photoresist are low plasma resistance and roughness formation in the ArF photoresist during plasma processes.
Takuji Uesugi +7 more
core +1 more source
Ion‐Reconfigurable “N”‐Shaped Antiambipolar Behavior in Organic Electrochemical Transistors
Advanced Materials, EarlyView.A unique N‐shaped negative differential transconductance (NDT) characteristics is demonstrated in single‐polymer organic electrochemical transistors through a sequential doping–redox–doping process driven by iodide ions. This redox‐driven mechanism enables low‐voltage, ion‐controlled reconfigurability and tunable current modulation, allowing seamless ...
Debdatta Panigrahi +11 more
wiley +1 more source
MEASUREMENT OF MICROHARDNESS OF PHOTORESIST FILMS ON SILICON BY THE SCRATCHING METHOD
Приборы и методы измерений, 2016 In recent years new types of resist for nano and submicronic lithography are intensively developed. As perspective materials for resist various polymeric compositions on a basis thermally and mechanically resistant polymers are considered. The purpose of
D. I. Brinkevich +5 more
doaj +1 more source