Results 51 to 60 of about 11,199 (255)
IEEE Photonics Journal, 2022 In this study, HATCN is coated on flexible PET/indium tin oxide (ITO) substrate as a modified layer and a hole injection layer to improve the hole injection from ITO.
Fuh-Shyang Juang +3 more
doaj +1 more source
Covalent Functionalization of 2D Semiconductors: A Roadmap to Advanced Electronic Devices
Advanced Functional Materials, EarlyView.This Review presents recent advances in the covalent functionalization strategies for two‐dimensional semiconductors and their implementation in modern technologies. Layered materials are modified through diverse molecular chemistries (e.g., thiols, diazonium salts, alkyl halides, and electron‐deficient species) to tailor their surface properties ...
Ramiro Quirós‐Ovies +2 more
wiley +1 more source
Conductive SU8 Photoresist for Microfabrication [PDF]
A conductive composite photoresist has been developed for the direct photopatterning of electrodes. It is based on a dispersion of silver nanoparticles in SU8, a non-conductive, negative-tone photoresist.
Bertsch, Arnaud +3 more
core +1 more source
Microfabrication of Ni-Fe Mold Insert via Hard X-ray Lithography and Electroforming Process
Metals, 2020 In this research, a Ni-Fe mold insert for the efficient replication of high aspect-ratio microstructure arrays was fabricated via hard X-ray lithography and an electroforming process.
Jae Man Park +7 more
doaj +1 more source
Advanced Functional Materials, EarlyView.A removable sacrificial polymer layer engineers the thermal boundary condition during nanosecond laser ablation of PET, suppressing heat‐affected‐zone formation without relying on costly ultrafast lasers. This strategy enables deep, high‐aspect‐ratio trenches with no detectable heat‐affected zone, templating silver‐filled mesh electrodes with record ...
Mehdi Zarei +3 more
wiley +1 more source
Lithography in three dimensions using computer-generated holograms [PDF]
, 2005 As electronic systems become ever more complicated, so the requirement for complex interconnection between systems increases. This is true at all levels from the chip metallisation itself, through the first die-level packaging to the Printed Circuit ...
Maiden, Andrew
core
Application of the Metal Reflector for Redistributing the Focusing Intensity of SPPs
Nanomaterials, 2020 The near-field photolithography system has attracted increasing attention in the micro- and nano-manufacturing field, due to the high efficiency, high resolution, and the low cost of the scheme.
Jiaxin Ji +5 more
doaj +1 more source
Out‐of‐Plane Strain‐Decoupled Architecture for High‐Fill‐Factor Stretchable OLED Displays
Advanced Functional Materials, EarlyView.A vertically decoupled multilayer SOLED architecture separates emissive pixel islands from deformable interconnects, allowing low‐modulus elastomeric layers to accommodate applied strain and suppress strain transfer to the OLED region. This design, combined with transparent hybrid encapsulation, enables a high fill factor (∼75%), stretchability ...
Young Hyun Son +2 more
wiley +1 more source
Design and fabrication of an ac-electro-osmosis micropump with 3D high-aspect-ratio electrodes using only SU-8 [PDF]
, 2011 Lab-on-a-chip devices require integrated pumping and fluid control in microchannels. A recently developed mechanism that can produce fluid flow is an integrated ac-electro-osmosis micropump.
Madou, Marc J +11 more
core +1 more source
Evaluation of replicas manufactured in a 3D-printed nanoimprint unit
Beilstein Journal of Nanotechnology, 2018 Nanoimprint lithography has become a useful tool to prepare elements containing nanoscale features at quite reasonable cost, especially if the fabrication elements are created in the own laboratory.
Manuel Caño-García +4 more
doaj +1 more source