Results 11 to 20 of about 92,867 (295)
The induction plasma chemical reactor: Part I. Equilibrium model [PDF]
A mathematical model is presented for the numerical simulation of the flow, temperature, and concentration fields in an rf plasma chemical reactor. The simulation is performed assuming chemical equilibrium. The extent of validity of this assumption is discussed. The system considered is the reaction of SiCl4 and NH3 for the production of Si3N4.
G. Y. Zhao, J. Mostaghimi, M. I. Boulos
openaire +1 more source
This study investigated predictions of reaction mechanisms and reaction rate law model covering effect of plasma role on the heterogeneous catalytic reaction of triglyceride and methanol to produce biodiesel (fatty acid methyl ester - FAME or fatty acid ...
P. Purwanto, Luqman Buchori, I. Istadi
doaj +1 more source
The induction plasma chemical reactor: Part II. Kinetic model [PDF]
A kinetic model has been developed for the prediction of the concentration gelds in an rf plasma reactor. A sample calculation for a SiCl4/H2 system is then performed. The model considers the mixing processes along with the kinetics of seven reactions involving the decomposition of these reactants.
G. Y. Zhao, J. Mostaghimi, M. I. Boulos
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The black silicon method II: the effect of mask material and loading on the reactive ion etching of deep silicon trenches [PDF]
Very deep trenches in Si with smooth controllable profiles are etched using a fluorine-based Reactive Ion Etcher(RIE). The effect of various mask materials and loading on the profile is examined using the Black Silicon Method. It is found that most metal
Boer, Meint de +4 more
core +9 more sources
Plasma-polymerised tetramethyldisiloxane (TMDSO) films are frequently applied as coatings for their abrasion resistance and barrier properties. By manipulating the deposition parameters, the chemical structure and thus mechanical properties of the films ...
Racim Radjef +5 more
doaj +1 more source
Analytical model of plasma-chemical etching in planar reactor [PDF]
The paper discusses an analytical model of plasma-chemical etching in planar diode- type reactor. Analytical expressions of etch rate and etch anisotropy were obtained. It is shown that etch anisotropy increases with increasing the ion current and ion energy.
D S Veselov +4 more
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Plasma Chemical Oxygen Conversion in an Industry‐Oriented Reactor Design
AbstractThe use of non‐thermal plasma enables chemical conversions as well as the removal of trace gas components. This application purpose has already been demonstrated for volume flow rates on a laboratory scale using a coaxial dielectric barrier discharge reactor.
Tim Nitsche +2 more
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Design of a Solid Freeform Fabrication Diamond Reactor [PDF]
Solid Freeform Fabrication (SFF) has progressed from the visualization aided stage of computer aided designs (CAD) to rapid prototyping of structural parts.
Marcus, Harris L. +2 more
core +1 more source
Tar Removal by Nanosecond Pulsed Dielectric Barrier Discharge
Plasma-catalytic reforming of simulated biomass tar composed of naphthalene, toluene, and benzene was carried out in a coaxial plasma reactor supplied with nanosecond high-voltage pulses. The effect of Rh-LaCoO3/Al2O3 and Ni/Al2O3 catalysts covering high-
Mirosław Dors, Daria Kurzyńska
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This study has been performed to reveal the main characteristics of operating a direct current (DC) plasma-chemical reactor (PChR) designed for hazardous waste treatment. The PChR employs thermal plasma as the operating environment.
Rolandas Uscila +5 more
doaj +1 more source

