Results 61 to 70 of about 1,972 (161)

Disclosing the Polysilicon Deposition Process

, 2010
The chemical route for producing hyperpure silicon, referred to as polysilicon, is energy intensive. In this work two paths are analysed to reduce energy consumption during polysilicon deposition: reduce power loss and increase polysilicon productivity.
Gonzalo del Coso, Gonzalo, Cañizo Nadal, Carlos del, Luque López, Antonio   +2 more
openaire   +2 more sources

Selective formation of tungsten nanowires

Nanoscale Research Letters, 2011
We report on a process for fabricating self-aligned tungsten (W) nanowires with polycrystalline silicon core. Tungsten nanowires as thin as 10 nm were formed by utilizing polysilicon sidewall transfer technology followed by selective deposition of ...
Bien Daniel, Saman Rahimah, Badaruddin Siti, Lee Hing   +3 more
doaj  

Dopant Diffusion‐Induced Dielectric Breakdown: Stacked Dielectric Reliability on Heavily Doped Polysilicon

Advanced Electronic Materials
This study identifies a novel failure mode in silicon dioxide/silicon nitride (SiO₂/Si₃N₄) capacitors caused by dopant diffusion in heavily doped polysilicon substrates.
Shuo Wang, Zebin Kong, Jie Zhao, Shukai Guan, Ranran Zhao, Anan Ju, Kunshu Wang, Pengfei Lian   +7 more
doaj   +1 more source

The adsorptive-kinetic model of in-situ phosphorus doped film polysilicon deposition process [PDF]

Tekhnologiya i Konstruirovanie v Elektronnoi Apparature, 2009
The investigation of deposition kinetics of in-situ phosphorus doped polysilicon films has been performed. The adsorptive-kinetic model of in-situ phosphorus doped polysilicon deposition has been developed.
Nalivaiko O. Yu., Turtsevich A. S.
doaj   +2 more sources

Mechanical characterization of polysilicon cantilevers using a thermo-mechanical test chip fabricated with a combined bulk/surface micromachining technique

Results in Physics, 2014
In this work a simplified low-frequency resonant method for the measurement of Young’s modulus of polysilicon cantilevers is described. We used a test chip, specially designed for characterizing thermal and mechanical properties, and fabricated using a ...
F.J. Quiñones-N, F.J. De la Hidalga-W, M. Moreno, J. Molina, C. Zúñiga, W. Calleja   +5 more
doaj   +1 more source

Microstructure for Thermal Impedance Spectroscopy for Biofuel Composition Measurement

Proceedings, 2017
Thermal impedance spectroscopy has been investigated as a non-destructive technique to determine the composition of ternary mixtures of biofuels.
Bo Jiang, Mohammadamir Ghaderi, Andre Bossche, Jaco H. Visser, Reinoud F. Wolffenbuttel   +4 more
doaj   +1 more source

Modeling Impact-induced Failure of Polysilicon MEMS: A Multi-scale Approach

Sensors, 2009
Failure of packaged polysilicon micro-electro-mechanical systems (MEMS) subjected to impacts involves phenomena occurring at several length-scales. In this paper we present a multi-scale finite element approach to properly allow for: (i) the propagation ...
Stefano Mariani, Aldo Ghisi, Alberto Corigliano, Sarah Zerbini   +3 more
doaj   +1 more source

A day-ahead and intraday scheduling method for polysilicon industrial parks with wind power integration based on flexible hydrogen production coupling

Energy Informatics
The increasing penetration of renewable energy introduces significant uncertainty to the operation of energy-intensive industries. To address this challenge, we propose a multi-timescale scheduling model for wind power integration in polysilicon ...
Yulong Yang, Chunye Qu, Songnan Wang, Jianwu Cai, Yaodong Gong   +4 more
doaj   +1 more source

Optimization strategy of triboelectric nanogenerators for high humidity environment service performance

EcoMat
With triboelectric nanogenerators (TENGs) introduced in 2012, they have emerged in the fields of flexible wearable electronics, portable energy, Internet of Things (IoTs), and biomedicine by virtue of their lightweight, high‐energy conversion, low cost ...
Xichen Yin, Zhou Chen, Hui Chen, Qing Wang, Qian Chen, Cheng Wang, Chaoyue Ye   +6 more
doaj   +1 more source

Impact of Grain Boundaries on The Electrical Characteristics and Breakdown Behavior of Polycrystalline Silicon Pin Diodes: A Simulation Study

ITEGAM-JETIA
In this paper, we present a comprehensive two-dimensional simulation program designed to model the intricate electrical characteristics of reverse-biased lateral polysilicon PIN diodes.
Abdelaziz Rabehi, Abdelmalek Douara, Elbar Mohamed, Roumaissa Zenzen, Mohamed Amrani   +4 more
doaj   +1 more source