Results 11 to 20 of about 1,001,875 (303)

Power cancellation of modules [PDF]

open access: yesPacific Journal of Mathematics, 1986
Let Mod-R (resp. \(Mod_ f-R)\) denote the category of unital right (resp. finitely generated) R-modules. \(X\in Mod_ f-R\) satisfies ''power cancellation'' if for all M,N\(\in Mod-R\), \(M\oplus X\cong N\oplus X\Rightarrow M^{(t)}\cong N^{(t)}\) for some ...
openaire   +2 more sources

A Stress-Relieved Method Based on Bottom Pattern Design Considering Thermal and Mechanical Behavior of DBC Substrate

open access: yesIEEE Access, 2022
Currently, stress analysis on direct bonded copper (DBC) is mainly based on a model with symmetrical top and bottom copper layers. These analyses provide thermal-mechanical stress-relieving methods at the outer edge of the copper-ceramic interface in DBC.
Chi Zhang   +4 more
doaj   +1 more source

FPGA-based module for SURF extraction [PDF]

open access: yes, 2014
We present a complete hardware and software solution of an FPGA-based computer vision embedded module capable of carrying out SURF image features extraction algorithm.
H Bay   +6 more
core   +1 more source

Space High-Voltage Power Module

open access: yesFrontiers in Energy Research, 2021
With the rapid development of the world’s aerospace technologies, a high-power and high-reliability space high-voltage power supply is significantly required by new generation of applications, including high-power electric propulsion, space welding, deep
Wenjie Zhao   +6 more
doaj   +1 more source

Analysis of heat dissipation for power module based on spatial interpolation algorithm

open access: yesDianzi Jishu Yingyong, 2018
In view of the difficulty in calculating the power module loss of the electric air conditioner and lack of heat dissipation design basis, the mechanism of heat production and heat dissipation is analyzed, the calculation method of actual loss value is ...
Lu Di, Xue Jingwei, Liang Jianing
doaj   +1 more source

Thermal Impedance Characterization Using Optical Measurement Assisted by Multi-Physics Simulation for Multi-Chip SiC MOSFET Module

open access: yesMicromachines, 2020
In this paper, an approach to determine the thermal impedance of a multi-chip silicon carbide (SiC) power module is proposed, by fusing optical measurement and multi-physics simulations.
Min-Ki Kim, Sang Won Yoon
doaj   +1 more source

Power module stray inductance extraction: Theoretical and experimental analysis

open access: yesETRI Journal, 2021
We propose a stray inductance extraction method on power modules of the few‐kilovolts/several‐hundred‐amperes class using only low voltages and low currents.
Dong Yun Jung   +9 more
doaj   +1 more source

Improved Optimal and Approximate Power Graph Compression for Clearer Visualisation of Dense Graphs [PDF]

open access: yes, 2013
Drawings of highly connected (dense) graphs can be very difficult to read. Power Graph Analysis offers an alternate way to draw a graph in which sets of nodes with common neighbours are shown grouped into modules.
Dwyer, Tim   +5 more
core   +1 more source

Understanding Turn-On Transients of SiC High-Power Modules: Drain-Source Voltage Plateau Characteristics

open access: yesEnergies, 2020
The SiC (silicon carbide) high-power module has great potential to replace the IGBT (insulated gate bipolar transistor) power module in high-frequency and high-power applications, due to the superior properties of fast switching and low power loss ...
Maosheng Zhang   +3 more
doaj   +1 more source

Heat Sink Design for WBG Power Modules Based on Fourier Series and Evolutionary Multi-Objective Multi-Physics Optimization

open access: yesIEEE Open Journal of Power Electronics, 2021
Optimal heat dissipation in power modules can significantly increase their power density. Removing the generated heat is critical for capturing the benefits of advanced semiconductor materials and improving the reliability of the device operation.
Emre Gurpinar, Raj Sahu, Burak Ozpineci
doaj   +1 more source

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